TRANSFER PRINTED DEVICE REPAIR
First Claim
1. A repaired transfer-printed system, comprising:
- a system substrate;
two or more contact pads disposed on the system substrate;
one or more transfer printed devices, each device comprising two or more connection posts, wherein each connection post is in physical contact with a contact pad of the two or more contact pads and forms a second imprint in the contact pad; and
a first imprint in at least one of the physically contacted contact pads that is between the device and the system substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A repaired transfer printed system (e.g., micro-transfer printed system) includes a system substrate having two or more contact pads disposed on the system substrate. One or more transfer printed devices (e.g., micro-transfer printed devices) are disposed in contact with the system substrate, each device having two or more connection posts. Each connection post of a replacement device is in physical contact with a contact pad, the connection post forming a second imprint in the physically contacted contact pad. In certain embodiments, a first imprint is in at least one of the physically contacted contact pads and is between the replacement device and the system substrate.
-
Citations
23 Claims
-
1. A repaired transfer-printed system, comprising:
-
a system substrate; two or more contact pads disposed on the system substrate; one or more transfer printed devices, each device comprising two or more connection posts, wherein each connection post is in physical contact with a contact pad of the two or more contact pads and forms a second imprint in the contact pad; and a first imprint in at least one of the physically contacted contact pads that is between the device and the system substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method of making a system, comprising:
-
providing a system substrate with two or more contact pads disposed on the system substrate; providing one or more source wafers each having one or more micro-transfer printable devices disposed thereon, each device comprising two or more connection posts; micro-transfer printing one or more devices from each of the one or more source wafers to the two or more contact pads with a transfer stamp comprising a corresponding one or more transfer stamp pillars such that each connection post physically contacts a contact pad of the two or more contact pads and forms a first imprint in the physically contacted contact pad; removing a defective device from the two or more contact pads to provide at least one exposed, imprinted contact pad comprising the first imprint; and micro-transfer printing a replacement device from one of the one or more source wafers to the two or more contact pads such that at least one connection post physically contacts the exposed, imprinted contact pad to form a second imprint. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
-
Specification