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Semiconductor package and method for fabricating a semiconductor package

  • US 20180174935A1
  • Filed: 12/12/2017
  • Published: 06/21/2018
  • Est. Priority Date: 12/13/2016
  • Status: Active Grant
First Claim
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1. A method of fabricating a semiconductor package, the method comprising:

  • providing a carrier;

    fabricating an opening in the carrier;

    attaching a semiconductor chip to the carrier; and

    fabricating an encapsulation body covering the semiconductor chip.

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