BONDED STRUCTURES
First Claim
Patent Images
1. A bonded structure comprising:
- a first element having a first interface feature;
a second element having a second interface feature; and
an integrated device coupled to or formed with the first element or the second element,the first interface feature directly bonded to the second interface feature to define an interface structure, the interface structure disposed around the integrated device to define an effectively closed profile to connect the first and second elements, the effectively closed profile substantially sealing an interior region of the bonded structure from gases diffusing into the interior region.
3 Assignments
0 Petitions
Accused Products
Abstract
A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.
-
Citations
47 Claims
-
1. A bonded structure comprising:
-
a first element having a first interface feature; a second element having a second interface feature; and an integrated device coupled to or formed with the first element or the second element, the first interface feature directly bonded to the second interface feature to define an interface structure, the interface structure disposed around the integrated device to define an effectively closed profile to connect the first and second elements, the effectively closed profile substantially sealing an interior region of the bonded structure from gases diffusing into the interior region. - View Dependent Claims (2, 4, 6, 7, 9, 10, 11, 20)
-
-
3. (canceled)
-
5. (canceled)
-
8. (canceled)
-
12. (canceled)
-
13. (canceled)
-
14. (canceled)
-
15. (canceled)
-
16. (canceled)
-
17. (canceled)
-
18. (canceled)
-
19. (canceled)
-
21. (canceled)
-
22. (canceled)
-
23. (canceled)
-
24. A bonded structure comprising:
-
a first element; a second element; an integrated device coupled to or formed within the first element or the second element; and an interface structure disposed between the first element and the second element, the interface structure comprising a first conductive interface feature extending in a direction from the first element to the second element, a second conductive interface feature extending in a direction from the first element to the second element, and a solid state non-conductive interface feature disposed laterally between the first and second conductive interface features, the interface structure disposed about the integrated device to define an effectively closed profile to connect the first element and the second element. - View Dependent Claims (25, 26, 28, 29, 30, 36)
-
-
27. (canceled)
-
31. (canceled)
-
32. (canceled)
-
33. (canceled)
-
34. (canceled)
-
35. (canceled)
-
37. (canceled)
-
38. (canceled)
-
39. (canceled)
-
40. (canceled)
-
41. A bonded structure comprising:
-
a first element; a second element; an integrated device coupled to or formed with the first element or the second element; an interface structure disposed between the first element and the second element, the interface structure comprising a first conductive interface feature laterally enclosing the integrated device, the conductive interface feature continuously extending between the first and second elements to form at least one of an electrical, mechanical, or thermal connection between the the two elements, and a non-conductive interface feature continuously extending between the first and second elements. - View Dependent Claims (42, 43, 44)
-
-
45. (canceled)
-
46. (canceled)
-
47. (canceled)
Specification