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MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

  • US 20180175901A1
  • Filed: 12/07/2017
  • Published: 06/21/2018
  • Est. Priority Date: 12/16/2016
  • Status: Active Grant
First Claim
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1. A multilayer printed circuit board including a plurality of substrate layers formed in a stack, the multilayer printed circuit board comprising:

  • a first substrate layer located on an outer side of the plurality of substrate layers;

    a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer; and

    a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

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