MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

• US 20180175901A1
• Filed: 12/07/2017
• Published: 06/21/2018
• Est. Priority Date: 12/16/2016
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: HEO, Jinsu, KO, Seungtae, LIM, Sangho
• Granted Patent: US 10,447,330 B2
• Time in Patent Office: Days
• CPC Class Codes: H04B 1/40 Circuits
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

Claims

1. A multilayer printed circuit board including a plurality of substrate layers formed in a stack, the multilayer printed circuit board comprising:

a first substrate layer located on an outer side of the plurality of substrate layers;

a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer; and

a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

2. The multilayer printed circuit board of claim 1, wherein the transmission line includes a plurality of sub-transmission lines disposed between and extended along at least three adjacent substrate layers among the plurality of substrate layers.

3. The multilayer printed circuit board of claim 1, wherein the sub-transmission line included in the transmission line is branched between the at least two adjacent substrate layers.

4. The multilayer printed circuit board of claim 1,

wherein the first point of the first substrate layer is connected to a radio frequency integrated circuit, and

wherein the second point of the second substrate layer is connected to an antenna module.

5. The multilayer printed circuit board of claim 1, further comprising:

a ground layer formed on at least one of the first or second substrate layers.

6. The multilayer printed circuit board of claim 5, further comprising:

a ground line surrounding the sub-transmission line and formed in a direction perpendicular to the at least two adjacent substrate layers.

7. The multilayer printed circuit board of claim 5, further comprising:

at least one additional ground layer formed between the at least two adjacent substrate layers and the at least one of the first or second substrate layers.

8. The multilayer printed circuit board of claim 7, wherein the sub-transmission line included in the transmission line is branched between the at least two adjacent substrate layers.

9. An electronic device comprising:

a multilayer printed circuit board including a plurality of substrate layers formed in stack,

wherein the multilayer printed circuit board includes;

a first substrate layer located on outer side of the plurality of substrate layers;

a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer; and

a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

10. The electronic device of claim 9, wherein the transmission line includes a plurality of sub-transmission lines disposed between and extended along at least three adjacent substrate layers among the plurality of substrate layers.

11. The electronic device of claim 9, wherein the sub-transmission line included in the transmission line is branched between the at least two adjacent substrate layers.

12. The electronic device of claim 9,

wherein the first point of the first substrate layer is connected to a radio frequency integrated circuit, and

wherein the second point of the second substrate layer is connected to an antenna module.

13. The electronic device of claim 9, further comprising:

a ground layer formed on at least one of the first or second substrate layers.

14. The electronic device of claim 13, further comprising:

a ground line surrounding the sub-transmission line and formed in a direction perpendicular to the at least two adjacent substrate layers.

15. The electronic device of claim 13, further comprising:

at least one additional ground layer formed between the at least two adjacent substrate layers and the at least one of the first or second substrate layers.

16. The electronic device of claim 15, wherein the sub-transmission line included in the transmission line is branched between the at least two adjacent substrate layers.