LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM INCLUDING THE SAME
First Claim
1. A laser processing head that is supported by a robot and emits a laser beam to a workpiece supported by a supporting apparatus that moves the workpiece during laser processing, the laser processing head comprising:
- at least one optical path changing member that reflects or refracts, toward the workpiece, the laser beam emitted from a predetermined laser beam output section so as to emit the laser beam to the workpiece;
a driver that changes posture or a position of the optical path changing member;
a control unit that controls the driver; and
a memory that stores target path information indicating a target path of the laser processing on the workpiece,wherein the control unit receives information relating to a relative position of the workpiece with respect to the laser processing head whose position and/or posture is changed by the robot while the laser processing is performed on the workpiece, and the control unit controls the driver by using the received information relating to the relative position and the target path information so as to perform the laser processing along the target path.
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Accused Products
Abstract
A laser processing head emits a laser beam to a workpiece that moves during laser processing and includes: optical path changing members that reflect, toward the workpiece, the laser beam emitted from a laser beam output section; a driver that changes posture of each of the optical path changing members; a control unit that controls the driver; and a memory device that stores target path information indicating a target path of the laser processing, in which the control unit receives information relating to a relative position of the workpiece with respect to the laser processing head, and controls the driver on the basis of the received information relating to the relative position and the target path information to perform the laser processing along the target path.
39 Citations
4 Claims
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1. A laser processing head that is supported by a robot and emits a laser beam to a workpiece supported by a supporting apparatus that moves the workpiece during laser processing, the laser processing head comprising:
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at least one optical path changing member that reflects or refracts, toward the workpiece, the laser beam emitted from a predetermined laser beam output section so as to emit the laser beam to the workpiece; a driver that changes posture or a position of the optical path changing member; a control unit that controls the driver; and a memory that stores target path information indicating a target path of the laser processing on the workpiece, wherein the control unit receives information relating to a relative position of the workpiece with respect to the laser processing head whose position and/or posture is changed by the robot while the laser processing is performed on the workpiece, and the control unit controls the driver by using the received information relating to the relative position and the target path information so as to perform the laser processing along the target path.
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2. A laser processing head that emits a laser beam to a workpiece supported by a supporting robot that moves the workpiece during laser processing, the laser processing head comprising:
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at least one optical path changing member that reflects or refracts, toward the workpiece, the laser beam emitted from a predetermined laser beam output section so as to emit the laser beam to the workpiece; a driver that changes posture or a position of the optical path changing member; a control unit that controls the driver; and a memory that stores target path information indicating a target path of the laser processing on the workpiece, wherein the control unit receives information relating to a relative position of the workpiece with respect to the laser processing head while the laser processing is performed on the workpiece, and the control unit controls the driver by using the received information relating to the relative position and the target path information so as to perform the laser processing along the target path.
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3. A laser processing system, comprising:
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a supporting apparatus that supports a workpiece and moves the workpiece during laser processing; a laser processing head that is supported by a robot and includes at least one optical path changing member, the optical path changing member being for reflecting or refracting a laser beam emitted from a predetermined laser beam output section toward the workpiece that is supported by the supporting apparatus and that is moved during the laser processing; a driver that is provided in the laser processing head and changes posture or a position of the optical path changing member; a control unit that controls the driver; and a memory that stores target path information indicating a target path of the laser processing on the workpiece, wherein the control unit receives information relating to a relative position of the workpiece with respect to the laser processing head whose position and/or posture is changed by the robot while the laser processing is performed on the workpiece, and the control unit controls the driver by using the received information relating to the relative position and the target path information so as to perform the laser processing along the target path.
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4. A laser processing system, comprising:
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a supporting robot that supports a workpiece and moves the workpiece during laser processing; a laser processing head that includes at least one optical path changing member, the optical path changing member being for reflecting or refracting a laser beam emitted from a predetermined laser beam output section toward the workpiece that is supported by the supporting robot and is moved during the laser processing; a driver that is provided in the laser processing head and changes posture or a position of the optical path changing member; a control unit that controls the driver; and a memory that stores target path information indicating a target path of the laser processing on the workpiece, wherein the control unit receives information relating to a relative position of the workpiece with respect to the laser processing head while the laser processing is performed on the workpiece, and the control unit controls the driver by using the received information relating to the relative position and the target path information so as to perform the laser processing along the target path.
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Specification