×

High Sensitivity Silicon Piezoresistor Force Sensor

  • US 20180180494A1
  • Filed: 12/22/2016
  • Published: 06/28/2018
  • Est. Priority Date: 12/22/2016
  • Status: Abandoned Application
First Claim
Patent Images

1. A sense die comprising:

  • a chip comprising a slab;

    one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least approximately 2/1;

    one or more bond pads supported by a first side of the chip, each of the one or more bond pads electrically coupled to at least one of the one or more sense elements;

    a structural frame disposed on the first side of the chip, wherein the structural frame is disposed at least partially about the slab; and

    one or more electrical contacts extending through the structural frame, wherein the one or more electrical contacts are electrically coupled to the one or more bond pads.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×