SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
First Claim
1. A substrate processing apparatus comprising:
- a process chamber where a substrate is processed;
a gas supply configured to supply a gas into the process chamber;
a plasma generator configured to plasma-excite the gas supplied into the process chamber, the plasma generator including an electrode electrically connected to a high frequency power source;
an impedance meter configured to measure an impedance of the plasma generator;
a determiner configured to determine an amount of active species of plasma generated by the plasma generator based on the impedance measured by the impedance meter; and
a controller configured to control the high frequency power source based on the amount of active species determined by the determiner.
2 Assignments
0 Petitions
Accused Products
Abstract
Described herein is a technique capable of uniformly processing substrates. According to the technique described herein, there is provided a substrate processing apparatus including: a process chamber where a substrate is processed; a gas supply configured to supply a gas into the process chamber; a plasma generator configured to plasma-excite the gas supplied into the process chamber, the plasma generator including an electrode electrically connected to a high frequency power source; an impedance meter configured to measure an impedance of the plasma generator; a determiner configured to determine an amount of active species generated by the plasma generator based on the impedance measured by the impedance meter; and a controller configured to control the high frequency power source based on the amount of active species determined by the determiner.
12 Citations
20 Claims
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1. A substrate processing apparatus comprising:
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a process chamber where a substrate is processed; a gas supply configured to supply a gas into the process chamber; a plasma generator configured to plasma-excite the gas supplied into the process chamber, the plasma generator including an electrode electrically connected to a high frequency power source; an impedance meter configured to measure an impedance of the plasma generator; a determiner configured to determine an amount of active species of plasma generated by the plasma generator based on the impedance measured by the impedance meter; and a controller configured to control the high frequency power source based on the amount of active species determined by the determiner. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a semiconductor device, comprising:
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(a) loading a substrate into a process chamber; (b) supplying a gas into the process chamber; (c) measuring an impedance of en electrode of a plasma generator electrically connected to a high frequency power source; (d) determining an amount of active species generated by the plasma generator based on the impedance measured in (c); (e) controlling the high frequency power source based on the amount of active species determined in (d) to activate the gas supplied into the process chamber into plasma; and (f) supplying the gas activated into plasma to the substrate. - View Dependent Claims (12, 13, 14, 15)
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16. A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform:
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(a) loading a substrate into a process chamber; (b) supplying a gas into the process chamber; (c) measuring an impedance of en electrode of a plasma generator electrically connected to a high frequency power source; (d) determining an amount of active species generated by the plasma generator based on the impedance measured in (c); (e) controlling the high frequency power source based on the amount of active species determined in (d) to activate the gas supplied into the process chamber into plasma; and (f) supplying the gas activated into plasma to the substrate. - View Dependent Claims (17, 18, 19, 20)
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Specification