DEVICES FOR ABSORBING ENERGY FROM ELECTRONIC COMPONENTS

• US 20180182685A1
• Filed: 01/17/2018
• Published: 06/28/2018
• Est. Priority Date: 09/11/2015
• Status: Active Grant

• Current Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Original Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Inventors: Strader, Jason L., Pruss, Eugene Anthony
• Granted Patent: US 10,453,773 B2
• Time in Patent Office: Days
• CPC Class Codes: F28F 21/02 of carbon, e.g. graphite
• CPC Class Codes: F28F 21/06 of plastics material
• CPC Class Codes: F28F 21/065 the heat-exchange apparatus employing plate-like or laminated conduits
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves

Abstract

A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.

Claims

1. A device for absorbing energy from an electronic component, the device comprising:

a low melting alloy layer including a first side and a second side opposing the first side,

a first coating layer substantially covering the first side of the low melting alloy layer, and

a second coating layer substantially covering the second side of the low melting alloy layer.

2. The device of claim 1, further comprising at least one thermally conductive layer coupled between the low melting alloy layer and one of the first or second coating layer.

3. The device of claim 2 wherein the low melting alloy layer is a first low melting alloy layer, the device further comprising a second low melting alloy layer coupled to the thermally conductive layer.

4. The device of claim 2 wherein the thermally conductive layer is a first thermally conductive layer, the device further comprising at least a second thermally conductive layer formed of graphite.

5. The device of claim 1 wherein the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture.

6. The device of claim 1, wherein the low melting alloy layer is a first low melting alloy layer, the device further comprising a second low melting alloy layer including a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture.

7. The device of claim 6, further comprising at least one thermally conductive layer coupled between the first low melting alloy layer and the second low melting alloy layer.

8. The device of claim 7, wherein the thermally conductive layer is formed of graphite.

9. The device of claim 8, wherein the thermally conductive layer is configured to couple to a reference potential and provide shielding of the electronic component.

10. The device of claim 7, wherein:

the thermally conductive layer is a metallic layer; and

/or

the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture.

11. The device of claim 10, wherein the low melting alloy layer has about a five weight percent or more of the plurality of low melting alloy particulates and/or wherein the low melting alloy layer has a thickness between about 0.1 mils and about 10 mils.

12. An assembly including an electronic component and the device of claim 1 coupled to the electronic component.

13. A device for absorbing energy from an electronic component, the device comprising:

a first thermally conductive layer including a first side and a second side opposing the first side;

two or more low melting alloy layers, one low melting alloy layer coupled to the first side of the first thermally conductive layer, another low melting alloy layer coupled to the second side of the first thermally conductive layer;

two or more graphite layers, one graphite layer coupled to said one low melting alloy layer, another graphite layer coupled to said another low melting alloy layer; and

two or more coating layers, one coating layer substantially covering one side of said one graphite layer, another coating layer substantially covering one side of said another graphite layer.

14. The device of claim 13, wherein at least one of the low melting alloy layers includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture.

15. The device of claim 13, wherein the first thermally conductive layer is formed of graphite.

16. The device of claim 13, wherein the first thermally conductive layer is a metallic layer.

17. The device of claim 13, wherein at least one of the graphite layers is configured to couple to a reference potential and provide shielding of the electronic component.

18. An assembly including an electronic component and the device of claim 13 coupled to the electronic component.

19. An assembly comprising:

an electronic component configured to generate energy; and

a thermally conductive layer defined by a first side coupled to the electronic component and a second side, the thermally conductive layer including a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture, the thermally conductive layer configured to absorb energy generated by the electronic component.

20. The assembly of claim 19, wherein:

the thermally conductive layer is configured to dissipate the absorbed energy without a dissipating device coupled to the thermally conductive layer; and

/or

the low melting alloy particulates are a first plurality of thermally conductive particulates and wherein the thermally conductive layer includes a second plurality of thermally conductive particles dispersed in the polymer mixture different than the first plurality of thermally conductive particulates.