×

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

  • US 20180182692A1
  • Filed: 11/30/2017
  • Published: 06/28/2018
  • Est. Priority Date: 12/28/2016
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device, comprising:

  • a first semiconductor chip having a first main surface over which a plurality of first electrodes and a plurality of second electrodes are formed;

    a second semiconductor chip having a second main surface over which a plurality of third electrodes and a plurality of fourth electrodes are formed;

    a chip mounting portion having a third main surface over which the first and second semiconductor chips are mounted;

    a plurality of leads arranged so as to surround the chip mounting portion;

    a plurality of suspension leads formed integrally with the chip mounting portion;

    a plurality of first conductive members electrically coupling the first electrodes to a plurality of first leads which are included in the leads;

    a plurality of second conductive members electrically coupling the third electrodes to a plurality of second leads which are included in the leads; and

    a sealing body sealing therein the first and second semiconductor chips, a portion of the chip mounting portion, a portion of each of the leads, the first conductive members, and the second conductive members,wherein, in plan view, the first semiconductor chip has the first main surface larger in area than the second main surface of the second semiconductor chip, a first side extending in a first direction, and a second side extending in a second direction crossing the first direction,wherein, in plan view, the second semiconductor chip has a third side extending in the first direction and a fourth side extending in the second direction,wherein, in plan view, the first side of the first semiconductor chip and the third side of the second semiconductor chip are located between the second side of the first semiconductor chip and the fourth side of the second semiconductor chip,wherein, in plan view, the chip mounting portion has a fifth side extending along and adjacent to the first side, a sixth side extending along and adjacent to the second side, a seventh side extending along and adjacent to the third side, an eighth side extending along and adjacent to the fourth side, and a ninth side located between the fifth and seventh sides and extending along the second direction,wherein, in plan view, the chip mounting portion has a first curved portion continued to each of the fifth and ninth sides and a second curved portion continued to each of the seventh and eighth sides,wherein, in plan view, the sealing body has a plurality of outside corner portions,wherein a first suspension lead which is included in the suspension leads extends from the seventh side toward a first outside corner portion which is among the outside corner portions of the sealing body,wherein a second suspension lead which is included in the suspension leads extends from the outside corner portion defined by the fifth and sixth sides toward a second outside corner portion which is among in the outside corner portions of the sealing body,wherein, in plan view, the second suspension lead has a tenth side extending from the chip mounting portion toward the second outside corner portion,wherein, in plan view, the chip mounting portion has a third curved portion continued to each of the tenth and fifth sides, andwherein each of the first and second curved portions has a radius of curvature larger than a radius of curvature of the third curved portion.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×