SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
First Claim
1. A semiconductor device, comprising:
- a first semiconductor chip having a first main surface over which a plurality of first electrodes and a plurality of second electrodes are formed;
a second semiconductor chip having a second main surface over which a plurality of third electrodes and a plurality of fourth electrodes are formed;
a chip mounting portion having a third main surface over which the first and second semiconductor chips are mounted;
a plurality of leads arranged so as to surround the chip mounting portion;
a plurality of suspension leads formed integrally with the chip mounting portion;
a plurality of first conductive members electrically coupling the first electrodes to a plurality of first leads which are included in the leads;
a plurality of second conductive members electrically coupling the third electrodes to a plurality of second leads which are included in the leads; and
a sealing body sealing therein the first and second semiconductor chips, a portion of the chip mounting portion, a portion of each of the leads, the first conductive members, and the second conductive members,wherein, in plan view, the first semiconductor chip has the first main surface larger in area than the second main surface of the second semiconductor chip, a first side extending in a first direction, and a second side extending in a second direction crossing the first direction,wherein, in plan view, the second semiconductor chip has a third side extending in the first direction and a fourth side extending in the second direction,wherein, in plan view, the first side of the first semiconductor chip and the third side of the second semiconductor chip are located between the second side of the first semiconductor chip and the fourth side of the second semiconductor chip,wherein, in plan view, the chip mounting portion has a fifth side extending along and adjacent to the first side, a sixth side extending along and adjacent to the second side, a seventh side extending along and adjacent to the third side, an eighth side extending along and adjacent to the fourth side, and a ninth side located between the fifth and seventh sides and extending along the second direction,wherein, in plan view, the chip mounting portion has a first curved portion continued to each of the fifth and ninth sides and a second curved portion continued to each of the seventh and eighth sides,wherein, in plan view, the sealing body has a plurality of outside corner portions,wherein a first suspension lead which is included in the suspension leads extends from the seventh side toward a first outside corner portion which is among the outside corner portions of the sealing body,wherein a second suspension lead which is included in the suspension leads extends from the outside corner portion defined by the fifth and sixth sides toward a second outside corner portion which is among in the outside corner portions of the sealing body,wherein, in plan view, the second suspension lead has a tenth side extending from the chip mounting portion toward the second outside corner portion,wherein, in plan view, the chip mounting portion has a third curved portion continued to each of the tenth and fifth sides, andwherein each of the first and second curved portions has a radius of curvature larger than a radius of curvature of the third curved portion.
1 Assignment
0 Petitions
Accused Products
Abstract
An improvement is achieved in the reliability of a semiconductor device. A SIP includes an analog chip, a microcomputer chip having a main surface smaller in area than a main surface of the analog chip, a die pad over which the analog chip and the microcomputer chip are mounted, and a plurality of leads arranged so as to surround the die pad. The SIP further includes a plurality of suspension leads formed integrally with the die pad, a plurality of wires electrically coupling electrodes of the analog chip to the leads and electrically coupling the microcomputer chip to the leads, and a sealing body sealing therein the analog chip and the microcomputer chip. Each of first and second curved portions of the die pad has a radius of curvature larger than a radius of curvature of a third curved portion of the die pad.
8 Citations
15 Claims
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1. A semiconductor device, comprising:
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a first semiconductor chip having a first main surface over which a plurality of first electrodes and a plurality of second electrodes are formed; a second semiconductor chip having a second main surface over which a plurality of third electrodes and a plurality of fourth electrodes are formed; a chip mounting portion having a third main surface over which the first and second semiconductor chips are mounted; a plurality of leads arranged so as to surround the chip mounting portion; a plurality of suspension leads formed integrally with the chip mounting portion; a plurality of first conductive members electrically coupling the first electrodes to a plurality of first leads which are included in the leads; a plurality of second conductive members electrically coupling the third electrodes to a plurality of second leads which are included in the leads; and a sealing body sealing therein the first and second semiconductor chips, a portion of the chip mounting portion, a portion of each of the leads, the first conductive members, and the second conductive members, wherein, in plan view, the first semiconductor chip has the first main surface larger in area than the second main surface of the second semiconductor chip, a first side extending in a first direction, and a second side extending in a second direction crossing the first direction, wherein, in plan view, the second semiconductor chip has a third side extending in the first direction and a fourth side extending in the second direction, wherein, in plan view, the first side of the first semiconductor chip and the third side of the second semiconductor chip are located between the second side of the first semiconductor chip and the fourth side of the second semiconductor chip, wherein, in plan view, the chip mounting portion has a fifth side extending along and adjacent to the first side, a sixth side extending along and adjacent to the second side, a seventh side extending along and adjacent to the third side, an eighth side extending along and adjacent to the fourth side, and a ninth side located between the fifth and seventh sides and extending along the second direction, wherein, in plan view, the chip mounting portion has a first curved portion continued to each of the fifth and ninth sides and a second curved portion continued to each of the seventh and eighth sides, wherein, in plan view, the sealing body has a plurality of outside corner portions, wherein a first suspension lead which is included in the suspension leads extends from the seventh side toward a first outside corner portion which is among the outside corner portions of the sealing body, wherein a second suspension lead which is included in the suspension leads extends from the outside corner portion defined by the fifth and sixth sides toward a second outside corner portion which is among in the outside corner portions of the sealing body, wherein, in plan view, the second suspension lead has a tenth side extending from the chip mounting portion toward the second outside corner portion, wherein, in plan view, the chip mounting portion has a third curved portion continued to each of the tenth and fifth sides, and wherein each of the first and second curved portions has a radius of curvature larger than a radius of curvature of the third curved portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a semiconductor device, comprising the steps of:
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(a) providing a lead frame having a chip mounting portion, a plurality of leads arranged so as to surround the chip mounting portion, and a plurality of suspension leads formed integrally with the chip mounting portion; (b) after the step (a), mounting a first semiconductor chip and a second semiconductor chip having a main surface smaller in plane area than a main surface of the first semiconductor chip over a main surface of the chip mounting portion; (c) after the step (b), electrically coupling some of a plurality of electrodes of the first semiconductor chip to some of the leads, some of a plurality of electrodes of the second semiconductor chip to some of the leads, and some of the electrodes of the first semiconductor chip to some of the electrodes of the second semiconductor chip via a plurality of conductive members; and (d) after the step (c), sealing the first and second semiconductor chips, a portion of the chip mounting portion, a portion of each of the leads, and the conductive members with a resin to form a sealing body, wherein, in the lead frame provided in the step (a), the chip mounting portion has a first portion and a second portion smaller in width than the first portion in plan view, and wherein, when it is assumed that an outside corner portion of the first portion which is defined in plan view by an eleventh side of the first portion extending along a first direction and a twelfth side of the first portion connected to the eleventh side and extending along a second direction crossing the first direction is a first curved portion, an outside corner portion of the second portion which is defined in plan view by a thirteenth side of the second portion extending along the first direction and a fourteenth side of the second portion connected to the thirteenth side and extending along the second direction is a second curved portion, and an inside corner portion defined in plan view by a fifteenth side of a suspension lead connected to the outside corner portion of the first portion and the eleventh side of the first portion connected to the fifteenth side is a third curved portion, each of the first and second curved portions has a radius of curvature larger than a radius of curvature of the third curved portion. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification