LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A light emitting device comprising:
- a substrate having a wiring pattern on an upper face thereof;
a light emitting element mounted on the wiring pattern of the substrate in a flip-chip manner, the light emitting element includinga semiconductor stack successively having a first semiconductor layer, an emission layer, and a second semiconductor layer, with the first semiconductor layer having a plurality of exposed portions exposed from the second semiconductor layer on an upper face side of the second semiconductor layer,an insulation film covering the semiconductor stack and having a plurality of openings respectively above the exposed portions of the first semiconductor layer,a first electrode connected to the exposed portions of the first semiconductor layer at the openings of the insulation film and partially disposed over the second semiconductor layer via the insulation film, anda second electrode connected to the second semiconductor layer;
a plurality of bumps disposed between the substrate and the light emitting element to mount the light emitting element on the substrate, the bumps including a plurality of first bumps bonded to the first electrode, and a plurality of second bumps bonded to the second electrode, the first bumps being spaced apart from the exposed portions of the first semiconductor layer, and the first bumps including a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view; and
a cover member covering the light emitting element, the bumps, and the substrate.
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Accused Products
Abstract
A light emitting device includes a substrate, a light emitting element, a plurality of bumps and a cover member. The bumps are disposed between the substrate and the light emitting element to mount the light emitting element on the substrate. The bumps include a plurality of first bumps bonded to a first electrode of the light emitting element, and a plurality of second bumps bonded to a second electrode of the light emitting element. The first bumps are spaced apart from exposed portions of a first semiconductor layer of the light emitting element. The first bumps include a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view. The cover member covers the light emitting element, the bumps, and the substrate.
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Citations
15 Claims
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1. A light emitting device comprising:
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a substrate having a wiring pattern on an upper face thereof; a light emitting element mounted on the wiring pattern of the substrate in a flip-chip manner, the light emitting element including a semiconductor stack successively having a first semiconductor layer, an emission layer, and a second semiconductor layer, with the first semiconductor layer having a plurality of exposed portions exposed from the second semiconductor layer on an upper face side of the second semiconductor layer, an insulation film covering the semiconductor stack and having a plurality of openings respectively above the exposed portions of the first semiconductor layer, a first electrode connected to the exposed portions of the first semiconductor layer at the openings of the insulation film and partially disposed over the second semiconductor layer via the insulation film, and a second electrode connected to the second semiconductor layer; a plurality of bumps disposed between the substrate and the light emitting element to mount the light emitting element on the substrate, the bumps including a plurality of first bumps bonded to the first electrode, and a plurality of second bumps bonded to the second electrode, the first bumps being spaced apart from the exposed portions of the first semiconductor layer, and the first bumps including a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view; and a cover member covering the light emitting element, the bumps, and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a light emitting device comprising:
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providing a substrate having a wiring pattern on an upper face thereof; forming a plurality of bumps for bonding a light emitting element to the wiring pattern so that the bumps include a plurality of first bumps and a plurality of second bumps with the first bumps including a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view; mounting the light emitting element onto the bumps in a flip-chip manner so that the first bumps are bonded to a first electrode of the light emitting element and the second bumps are bonded to a second electrode of the light emitting element; and forming a cover member that covers lateral faces of the light emitting element and the bumps. - View Dependent Claims (13, 14, 15)
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Specification