NON-CONDUCTIVE FRAME COATED WITH CONDUCTIVE LAYER TRANSMITTING ELECTROMAGNETIC WAVES OR HAVING FUNCTION OF HEAT RADIATION

• US 20180183480A1
• Filed: 12/22/2017
• Published: 06/28/2018
• Est. Priority Date: 12/22/2016
• Status: Abandoned Application

• Current Assignee: Jae Beom Kim
• Original Assignee: Jae Beom Kim
• Inventors: KIM, Jae Beom
• Application Number:
  US15/851,753
• Publication Number:
  US 20180183480A1
• Time in Patent Office: Days
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C
• CPC Class Codes: H01F 27/02 Casings
• CPC Class Codes: H01F 27/025 Constructional details relating to cooling
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01Q 1/242 specially adapted for hand-held use
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/44 using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/0283 for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate

Abstract

Disclosed herein is a non-conductive frame coated with a conductive layer transmitting electromagnetic waves or having a function of heat radiation including a non-conductive frame functioning as a medium and being used in a device including a wireless electromagnetic wave transmitting module or a wireless electromagnetic wave transmitting or receiving module, and a conductive layer formed on one surface of the non-conductive frame, wherein one or more grooves are formed on at least one area of the conductive layer so as to pass through the at least one area in order to allow the non-conductive frame to be exposed, thereby giving a characteristic of electromagnetic wave transmission, and wherein one or more slits are formed on the non-conductive frame along with the groove. According to the above-described invention, the non-conductive frame coated with a conductive layer transmitting electromagnetic waves or having a function of heat radiation may have an advantageous effect of being attached to an outer case of diverse devices that is configured of plastic, being equipped inside the device and, most particularly, being capable of enhancing the aesthetic external features of the device by adding a metallic texture when applied to the outer case.

Claims

1. A non-conductive frame coated with a conductive layer transmitting electromagnetic waves or having a function of heat radiation, comprising:

a non-conductive frame functioning as a medium and being used in a device including a wireless electromagnetic wave transmitting module or a wireless electromagnetic wave transmitting or receiving module; and

a conductive layer formed on one surface of the non-conductive frame,

wherein one or more grooves are formed on at least one area of the conductive layer so as to pass through the at least one area in order to allow the non-conductive frame to be exposed, thereby giving a characteristic of electromagnetic wave transmission, and wherein one or more slits are formed on the non-conductive frame along with the groove, and

wherein the non-conductive frame having a conductive layer formed on one surface thereof does not directly contact the wireless electromagnetic wave transmitting module or the wireless electromagnetic wave transmitting or receiving module, and wherein the module is capable of performing electromagnetic wave transmission.

2. The non-conductive frame of claim 1, wherein the frame is formed or processed by using at least of one of 3D printing, laser processing, cutting, and etching, and

wherein the one or more slits are formed or processed by using at least one of 3D printing, sawing, laser processing, punching, and etching.

3. The non-conductive frame of claim 1, wherein the conductive layer is formed by using at least one of 3D printing, plating, coating, printing, vacuum evaporation, and adhesion.

4. The non-conductive frame of claim 1, wherein the non-conductive frame coated with a conductive layer is installed at a position corresponding to a main transmitting direction or a main receiving direction of a transmitting unit or receiving unit of wireless power or wireless charging included in the device.

5. The non-conductive frame of claim 1, wherein a plurality of non-conductive frames coated with a conductive layer are layered in a multi-layer structure on a near field communication (NFC) module included in the device.

6. The non-conductive frame of claim 5, wherein the plurality of non-conductive frames coated with a conductive layer are layered so that positions of the grooves or slits are vertically identical to one another, or that positions of the grooves or slits are alternated.

7. The non-conductive frame of claim 1, wherein a plurality of non-conductive frames coated with a conductive layer are layered one over another, and wherein a color of a lower frame is recognized through one or more grooves or slits of an upper frame.

8. The non-conductive frame of claim 7, wherein a lower conductive layer and an upper conductive layer are configured to have different colors so that the color of the lower conductive layer is recognized through one or more grooves or slits of the upper conductive layer.

9. The non-conductive frame of claim 7, wherein a lower non-conductive frame and an upper non-conductive frame are configured to have different colors so that the color of the lower non-conductive frame is recognized through one or more grooves or slits of the upper non-conductive frame.

10. The non-conductive frame of claim 7, wherein a plurality of non-conductive frames coated with a conductive layer are layered one over another, and wherein an insulating layer is further included between each non-conductive frame, and wherein the insulating layer corresponds to any one of air, a film, and a coating layer.

11. The non-conductive frame of claim 10, wherein the insulating layer and the upper frame are configured to have different colors so that the color of the insulating layer is recognized through one or more grooves or slits of the upper film.

12. The non-conductive frame of claim 7, wherein, when a plurality of non-conductive frame coated with a conductive layer are layered one over another, patterns of a lower film are configured to not overlap with an upper film, thereby allowing one or more grooves or slits formed on the lower film to be hidden.

13. The non-conductive frame of claim 1, wherein the non-conductive frame coated with a conductive layer is connected to a substrate so as to be applied to a mobile device and used as an antenna.

14. The non-conductive frame of claim 1, wherein an average width of a groove or slit is equal to or less than 2 times an average width between two adjacent grooves or slits.

15. The non-conductive frame of claim 1, wherein the groove or slit has a width exceeding 0 and less than or equal to several millimeters (mm).

16. The non-conductive frame of claim 1, wherein an area where the one or more slits are formed is larger than an area occupied by a wireless transmitting/receiving module for transmitting electromagnetic waves, and wherein an entire area occupied by the wireless transmitting/receiving module is positioned to overlap with at least a portion of the area where the one or more slits are formed.