SEMICONDUCTOR WAFER AND METHOD OF PROBE TESTING
First Claim
1. A method of making a semiconductor device, comprising:
- providing a semiconductor wafer;
providing a wafer holder including a tape portion with an opening through the tape portion;
mounting the semiconductor wafer over the opening in the tape portion of the wafer holder; and
providing an electrical connection to the semiconductor wafer through the opening in the tape portion during probe test.
3 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor test system has a wafer holder with a tape portion and one or more openings through the tape portion. A semiconductor wafer is mounted over the opening in the tape portion of the wafer holder with an electrical connection to the semiconductor wafer through the opening in the tape portion during probe test. A plurality of bumps can be formed on the semiconductor wafer. The semiconductor wafer can be a stacked semiconductor wafer. A conductive trace can be formed on the tape portion and the semiconductor wafer probe tested through the conductive trace. An active surface or non-active surface of the semiconductor wafer can be oriented toward the tape portion. The electrical connection to the semiconductor wafer through the opening in the tape portion can be a ground reference node. A conductive layer is formed over a non-active surface of the semiconductor wafer.
3 Citations
20 Claims
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1. A method of making a semiconductor device, comprising:
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providing a semiconductor wafer; providing a wafer holder including a tape portion with an opening through the tape portion; mounting the semiconductor wafer over the opening in the tape portion of the wafer holder; and providing an electrical connection to the semiconductor wafer through the opening in the tape portion during probe test. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus for probe testing a semiconductor device, comprising:
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a semiconductor wafer; and a wafer holder including a tape portion with an opening through the tape portion, wherein the semiconductor wafer is mounted over the opening in the tape portion of the wafer holder with an electrical connection to the semiconductor wafer through the opening in the tape portion during probe test. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. An apparatus for probe testing a semiconductor device, comprising:
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a semiconductor wafer; and a wafer holder including a tape portion; and a conductive trace formed on the tape portion, wherein the semiconductor wafer is mounted over the tape portion of the wafer holder with an electrical connection to the semiconductor wafer through the conductive layer during probe test. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification