CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

• US 20180190593A1
• Filed: 12/30/2016
• Published: 07/05/2018
• Est. Priority Date: 12/30/2016
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Application Number:
  US15/396,415
• Publication Number:
  US 20180190593A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/2731 in liquid form
• CPC Class Codes: H01L 2224/27318 by dispensing droplets
• CPC Class Codes: H01L 2224/27418 Spray coating
• CPC Class Codes: H01L 2224/27505 Sintering
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29113 Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/29139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32503 comprising an intermetallic compound
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8322 with energy being in the form of electromagnetic radiation
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/0635 : Acrylic polymer
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 31/107 : the potential barrier working in avalanche mode, e.g. avalanche photodiodes

Abstract

In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Claims

1. A method comprising:

providing a portion of a semiconductor package including one or more electronic components attached to a board having one or more grounding pads proximate to the one or more electronic components;

depositing a conductive adhesive layer comprising conductive nanoparticles to at least a portion of the one or more grounding pads;

placing a shielding structure on the board over at least a portion of the conductive adhesive layer and covering at least one of the one or more electronic components; and

applying heat to the conductive adhesive layer at a first temperature equal to or less than 75 degrees Celsius for a first duration.

2. The method of claim 1, wherein applying the conductive adhesive layer comprises applying the conductive adhesive layer using a spraying technique, a plating technique, a printing technique, or a dispensing technique.

3. The method of claim 1, wherein applying the conductive adhesive layer comprises applying the conductive adhesive layer using a spraying technique, wherein the spraying technique comprises an atomization technique, an electrospray technique, or an ultrasonic technique.

4. The method of claim 1, wherein applying the conductive adhesive layer comprises applying the conductive adhesive layer using a printing technique, wherein the printing technique comprises a vacuum printing technique.

5. The method of claim 1, wherein applying the conductive adhesive layer comprises applying the conductive adhesive layer using a dispensing technique, wherein the dispensing technique comprises an Auger dispensing technique or a jet dispensing technique.

6. The method of claim 1, wherein applying heat comprises photonic curing.

7. The method of claim 1, wherein the conductive adhesive layer comprises sintering nanoparticles, non-sintering pastes, non-sintering inks, intermetallic compound forming material, or conductive particles.

8. The method of claim 1, wherein the conductive adhesive layer comprises sintering nanoparticles, wherein the sintering nanoparticles comprise silver or copper.

9. The method of claim 1, wherein the conductive adhesive layer comprises non-sintering pastes, wherein the non-sintering pastes comprise a metal.

10. The method of claim 1, wherein the conductive adhesive layer comprises non-sintering pastes, wherein the non-sintering pastes comprise an epoxy acrylic adhesive system or a polymer system.

11. The method of claim 1, wherein the conductive adhesive layer comprises non-sintering inks, wherein the non-sintering inks comprise an epoxy acrylic adhesive system or a polymer system.

12. The method of claim 1, wherein the conductive adhesive layer comprise conductive particles, wherein the conductive particles include fibers, flakes, nanoparticles, or graphite.

13. The method of claim 1, wherein the semiconductor package comprises an optoelectronic package.

14. A semiconductor package, comprising:

a substrate having two or more electronic components and one or more grounding pads proximate to the two or more electronic components;

a conductive adhesive layer disposed on at least a portion of the one or more grounding pads, the conductive adhesive layer applied between the two or more electronic components; and

a shielding structure disposed over at least a portion of the two or more electronic component, the shielding structure being in contact with at least one of the one or more grounding pads or the conductive adhesive layer.

15. The semiconductor package of claim 14, wherein the conductive adhesive layer comprises sintering nanoparticles, non-sintering pastes, non-sintering inks, intermetallic compound forming material, or conductive particles.

16. The semiconductor package of claim 14, wherein the conductive adhesive layer comprises an intermetallic compound-forming material, wherein the intermetallic compound-forming material comprises a SnBiCu paste.

17. The semiconductor package of claim 14, wherein the conductive adhesive layer comprises sintering nanoparticles, wherein the sintering nanoparticles comprise silver or copper.

18. The semiconductor package of claim 14, wherein the conductive adhesive layer comprises non-sintering pastes or non-sintering inks, wherein the non-sintering pastes or the non-sintering inks comprise a metal.

19. The semiconductor package of claim 14, wherein the conductive adhesive layer comprises non-sintering pastes or non-sintering inks, wherein the non-sintering pastes or non-sintering inks comprise an epoxy acrylic adhesive system or a polymer system.

20. The semiconductor package of claim 14, wherein the conductive adhesive layer comprises conductive particles, wherein the conductive particles include fibers, flakes, nanoparticles, or graphite.

21. The semiconductor package of claim 14, wherein the one or more electronic components comprise an avalanche photodiode or a laser diode.

22. The semiconductor package of claim 17, further comprising an optoelectronic package, wherein the shielding structure covers at least a portion of the optoelectronic package.

23. A device, comprising:

a processor;

a memory device in communication with the processor, the memory device comprising;

a substrate having two or more electronic components and one or more grounding pads proximate to the two or more electronic components;

a conductive adhesive layer disposed on at least a portion of the one or more grounding pads, the conductive adhesive layer applied between the two or more electronic components; and

a shielding structure disposed over at least a portion of the two or more electronic component, the shielding structure being in contact with at least one of the one or more grounding pads or the conductive adhesive layer.

24. The device of claim 23, wherein the conductive adhesive layer comprises sintering nanoparticles, non-sintering pastes, non-sintering inks, intermetallic compound forming material, or conductive particles.

25. The device of claim 23, further comprising an optoelectronic package, wherein the shielding structure covers at least a portion of the optoelectronic package.