MICROELECTROMECHANICAL SYSTEM MICROPHONE
First Claim
1. A microelectromechanical system comprising:
- a diaphragm with a first surface and a second surface, wherein the first surface is exposed to an environmental pressure, and wherein the second surface comprises a plurality of fingers extending from the second surface;
a backplate comprising a plurality of voids, wherein each of the plurality of fingers extends into a respective one of the plurality of voids; and
an insulator between a portion of the diaphragm and a portion of the backplate,wherein the diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure.
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Accused Products
Abstract
A microelectromechanical system (MEMS) includes a diaphragm with a first surface and a second surface. The first surface is exposed to an environmental pressure. The second surface comprises a plurality of fingers extending from the second surface. The MEMS also includes a backplate comprising a plurality of voids. Each of the plurality of fingers extends into a respective one of the plurality of voids. The MEMS further includes an insulator between a portion of the diaphragm and a portion of the backplate. The diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure.
44 Citations
20 Claims
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1. A microelectromechanical system comprising:
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a diaphragm with a first surface and a second surface, wherein the first surface is exposed to an environmental pressure, and wherein the second surface comprises a plurality of fingers extending from the second surface; a backplate comprising a plurality of voids, wherein each of the plurality of fingers extends into a respective one of the plurality of voids; and an insulator between a portion of the diaphragm and a portion of the backplate, wherein the diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. The microelectromechanical device of system 1, further comprising an inside volume defined at least in part by the diaphragm, the backplate, and the insulator, and wherein a pressure of the inside volume is less than the environmental pressure.
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9. The microelectromechanical device of system 8, wherein the pressure of the inside volume has a negative gauge pressure.
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10. A microelectromechanical system (MEMS) microphone package comprising:
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a substrate; a MEMS transducer disposed on the substrate and comprising; a diaphragm having a first surface and a second surface, wherein the first surface is exposed to an environmental pressure, and wherein the second surface comprises a plurality of fingers extending from the second surface; a backplate having a plurality of voids, wherein each of the plurality of fingers extends into one of the plurality of voids; and an insulator between a portion of the diaphragm and a portion of the backplate, wherein the diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure; a processing circuit operatively coupled to the MEMS transducer and configured to; apply a constant voltage across the diaphragm and the insulator; and generate an electrical signal based on a capacitance between the diaphragm and the backplate, wherein the electrical signal is representative of the changes in the environmental pressure; and a cover coupled to the substrate and structured to cover the MEMS transducer and processing circuit. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification