FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-LAYER GROUND LAYER STRUCTURE

• US 20180206332A1
• Filed: 03/16/2018
• Published: 07/19/2018
• Est. Priority Date: 09/24/2015
• Status: Active Grant

• Current Assignee: GigaLane Co., Ltd.
• Original Assignee: GigaLane Co., Ltd.
• Inventors: Kim, Sang Pil, Lee, Da Yeon, Koo, Hwang Sub, Kim, Hyun Je, Jung, Hee Seok
• Granted Patent: US 10,362,675 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/0225 Single or multiple openings in a shielding, ground or power plane H05K1/0227 takes precedence
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09327 Special sequence of power, ground and signal layers in multilayer PCB
• CPC Class Codes: H05K 3/0044 Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/4694 Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density H05K3/4691 takes precedence
• CPC Class Codes: H05K 3/4697 having cavities, e.g. for mounting components H05K3/4691 takes precedence

Abstract

Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.

Claims

1. A flexible circuit board having three-layer dielectric and four-layer ground layer structure, the flexible circuit board comprising:

a first dielectric;

a second dielectric facing an upper surface of the first dielectric;

a third dielectric facing a bottom surface of the first dielectric;

a signal line formed on the upper surface of the first dielectric;

a pair of first ground layers stacked on the first dielectric with the signal line therebetween;

a second ground layer stacked on the bottom surface of the first dielectric corresponding to the first ground layer;

a third ground layer stacked on the second dielectric; and

a fourth ground layer stacked on the bottom surface of the third dielectric.

2. The flexible circuit board according to claim 1,

wherein a plurality of ground holes are formed in the third ground layer at regular and predetermined distances in the longitudinal direction of the signal lines, and the fourth ground layer is surface-bonded in a shape corresponding to the third dielectric.

3. The flexible circuit board according to claim 2,

wherein the third dielectric is thicker than the second dielectric.

4. The flexible circuit board according to claim 3,

wherein the first ground layer and the second dielectric are bonded via a first bonding sheet, and the second ground layer and the third dielectric are bonded via a second bonding sheet.

5. The flexible circuit board according to claim 4,

wherein the first bonding sheet is provided in a pair with a signal line therebetween, and the first bonding sheet is interposed between a pair of the first ground layers and the second dielectric to form an inner space defined by the second dielectric, the first bonding sheet, the first ground layer and the first dielectric.

6. The flexible circuit board according to claim 1,

wherein a first substrate part comprises the first dielectric, the second dielectric, the third dielectric, the signal line, the first ground layer, the second ground layer, the third ground layer, and the fourth ground layer;

wherein a second substrate part comprises the second dielectric, the signal line, the first ground layer, the first dielectric, the second ground layer, and the third dielectric, extended from the first substrate part respectively;

wherein a third substrate part comprises the first ground layer, the signal line, the first dielectric, and the second ground layer, extended from the second substrate part respectively.

7. The flexible circuit board according to claim 6,

wherein the signal line comprises the first signal line and a pair of the second signal lines branched from the first signal line and positioned in parallel with each other.

8. The flexible circuit board according to claim 1,

wherein a first substrate part comprises the first dielectric, the second dielectric, the third dielectric, the signal line, the first ground layer, the second ground layer, the third ground layer, and the fourth ground layer;

wherein a second substrate part comprises the second dielectric, the signal line, the first ground layer, the first dielectric, the second ground layer, and the third dielectric, extended from the first substrate part respectively;

wherein a third substrate part comprises the signal line, the first dielectric, and the second ground layer, extended from the second substrate part respectively;

wherein the signal line includes a first signal line and a pair of second signal lines branched from the first signal line and positioned in parallel with each other.

9. The flexible circuit board according to claim 1,

wherein a first substrate part comprises the first dielectric, the second dielectric, the third dielectric, the signal line, the first ground layer, the second ground layer, the third ground layer, and the fourth ground layer;

wherein a second substrate part comprises the second dielectric, the signal line, the first ground layer, the first dielectric, the second ground layer, and the third dielectric, extended from the first substrate part respectively;

wherein a third substrate part comprises the signal line, the first dielectric, and the first ground layer, extended from the second substrate part respectively;

wherein the signal line includes a first signal line and a pair of second signal lines branched from the first signal line and positioned in parallel with each other.

10. The flexible circuit board according to claim 7,

wherein a gap between the second signal line and the first ground layer is smaller than an gap between the first signal line and the first ground layer.

11. The flexible circuit board according to claim 9,

wherein a gap between the second signal line and the first ground layer is smaller than an gap between the first signal line and the first ground layer.