Method for Attaching Wiring Protective Film Layer, Wiring Structure and Display Panel

• US 20180211847A1
• Filed: 06/22/2017
• Published: 07/26/2018
• Est. Priority Date: 07/01/2016
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Chengdu BOE Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Original Assignee: BOE Technology Group Co., Ltd., Chengdu BOE Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Inventors: ZENG, Mu, WANG, Tao, WANG, Zhouping, YANG, Guowen
• Granted Patent: US 10,446,413 B2
• Time in Patent Office: Days
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/136286 Wiring, e.g. gate line, drain line
• CPC Class Codes: G02F 2201/50 Protective arrangements
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals

Abstract

The present disclosure provides a method for attaching a wiring protective film layer, a wiring structure and a display panel. The attaching method comprises: forming a protective structure comprising a protective film layer and a carrier layer disposed in stack on a wiring layer, wherein the wiring layer and the protective film layer are in contact; and removing the carrier layer and remaining the protective film layer.

Claims

1-15. -15. (canceled)

16. A method for attaching a wiring protective film layer comprising:

step S1;

forming a protective structure comprising a protective film layer and a carrier layer disposed in stack on a wiring layer, wherein the wiring layer and the protective film layer are in contact; and

step S2;

removing the carrier layer and remaining the protective film layer.

17. The method for attaching a wiring protective film layer according to claim 16, wherein after the step S2, the method for attaching a wiring protective film layer further comprises:

step S3;

curing the protective film layer.

18. The method for attaching a wiring protective film layer according to claim 17, wherein during step S3, curing the protective film layer is performed by UV curing.

19. The method for attaching a wiring protective film layer according to claim 17, wherein during step S3, curing the protective film layer is performed by ozone curing.

20. The method for attaching a wiring protective film layer according to claim 16, wherein the step S1 comprises:

step S11;

cutting a thin film of the protective film layer to form the protective film layer, but not cutting a thin film of the carrier layer disposed in stack with the thin film of the protective film layer, a part of the thin film of the carrier layer corresponding to the protective film layer being the carrier layer; and

step S12;

attaching the protective film layer and the carrier layer disposed in stack onto the wiring layer.

21. The method for attaching a wiring protective film layer according to claim 20, wherein the step S12 comprises:

attaching the protective film layer and the carrier layer disposed in stack onto the wiring layer by a pressure head device.

22. The method for attaching a wiring protective film layer according to claim 16, wherein after the step S1 and before the step S2, the method for attaching a wiring protective film layer further comprises:

step S41;

removing any bubble between the protective film layer and the wiring layer.

23. The method for attaching a wiring protective film layer according to claim 22, wherein the step S41 comprises:

removing the bubble using a resilient attaching roller rolling on the protective film layer.

24. The method for attaching a wiring protective film layer according to claim 17, wherein after the step S2 and before the step S3, the method for attaching a wiring protective film layer further comprises:

step S42;

removing any bubble between the protective film layer and the wiring layer.

25. The method for attaching a wiring protective film layer according to claim 24, wherein the step S42 comprises:

removing the bubble using a resilient attaching roller rolling on the protective film layer.

26. The method for attaching a wiring protective film layer according to claim 16, wherein after the step S2, the method for attaching a wiring protective film layer further comprises:

recovering the carrier layer by means of reel rotation.

27. The method for attaching a wiring protective film layer according to claim 16, wherein the step S2 comprises:

peeling off the carrier layer carrying the protective film layer by a peeling device comprising two peeling rods respectively provided on upper and lower sides of the carrier layer.

28. A wiring structure, comprising:

a wiring layer; and

a protective structure comprising a protective film layer and to be attached using the method for attaching a wiring protective film layer according to claim 16 so that the wiring layer and the protective film layer are in contact.

29. The wiring structure according to claim 28,

wherein the protective film layer has a thickness no greater than approximately 30 μ

m.

30. A display panel, comprising the wiring structure according to claim 28.

31. The display panel according to claim 30,

wherein the wiring structure is located at a non-display area of the display panel.