STACKED PIXEL STRUCTURES

• US 20180211945A1
• Filed: 01/22/2018
• Published: 07/26/2018
• Est. Priority Date: 01/26/2017
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Cok, Ronald S., Raymond, Brook, Bower, Christopher Andrew
• Granted Patent: US 10,332,868 B2
• Time in Patent Office: Days
• CPC Class Codes: G09G 3/2088 with use of a plurality of processors, each processor controlling a number of individual elements of the matrix
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A micro-transfer printed high-resolution inorganic light-emitting diode (iLED) display includes a display substrate and a plurality of pixels disposed over the display substrate, each pixel comprising a pixel controller disposed or formed in or on a pixel substrate and controlling one or more iLEDs disposed or formed in or on respective iLED substrates. The one or more iLEDs are disposed above or below the pixel controller in a separate layer from the pixel controller. The display substrate, the iLED substrate(s), and the pixel substrate are all separate, independent and distinct, and the one or more iLEDs and pixel controller are each separate devices.

Claims

1. A high-resolution inorganic light-emitting diode (iLED) display, comprising:

a display substrate having a display area; and

a plurality of pixels disposed over the display substrate in the display area, each pixel comprising a pixel control device and one or more inorganic light-emitting diode (iLED) devices electrically connected to and controlled by the pixel control device to emit light, wherein;

the pixel control devices each comprise a pixel controller that is disposed or formed in, on, or in direct contact with a pixel substrate separate, independent, and distinct from the display substrate,

the one or more iLED devices each comprise an iLED that is disposed or formed in, on, or in direct contact with an iLED substrate separate, independent, and distinct from the display substrate and from the pixel substrates,

the one or more iLED devices are disposed in direct contact with the pixel control device and do not extend beyond the pixel controller, and

the pixel controller is disposed in a controller layer over the display substrate and the one or more iLED devices are disposed in an iLED layer different from the controller layer over the display substrate.

2. The high-resolution iLED display of claim 1, wherein the iLED layer is disposed between the controller layer and the display substrate, the display substrate is at least partly transparent to the light emitted by the iLED, and the iLED is disposed to emit light through the display substrate.

3. The high-resolution iLED display of claim 1, wherein the controller layer is disposed between the iLED layer and the display substrate and the iLEDs are disposed to emit light in a direction away from the display substrate.

4. The high-resolution iLED display of claim 1, wherein one or more of the one or more iLED devices, the iLED substrate, the pixel control device, and the pixel substrate comprises a broken or separated tether.

5. The high-resolution iLED display of claim 1, wherein the iLED substrate comprises a semiconductor iLED substrate or a dielectric iLED substrate.

6. The high-resolution iLED display of claim 5, wherein the pixel control device comprises connection posts electrically connecting the pixel controller to the display substrate.

7. The high-resolution iLED display of claim 5, wherein the iLED substrate comprises a broken or separated tether.

8. The high-resolution iLED display of claim 7, wherein the one or more iLED devices comprises three iLED devices disposed in the iLED layer, wherein each of the iLEDs of the three iLED devices emit light of a different color than the iLED of each other iLED device of the three iLED devices.

9. The high-resolution iLED display of claim 1, wherein the one or more iLED devices each comprises connection posts electrically connecting the iLED to at least one of (i) the pixel controller of the pixel control device on which the iLED device is disposed and (ii) the display substrate.

10. The high-resolution iLED display of claim 1, wherein the pixel substrate comprises a semiconductor pixel substrate or a dielectric pixel substrate.

11. The high-resolution iLED display of claim 10, wherein the pixel substrate comprises a broken or separated tether.

12. A micro-assembled pixel, comprising:

a pixel control device comprising a pixel controller and a pixel substrate, the pixel controller formed or disposed in, on, or in direct contact with the pixel substrate; and

one or more inorganic light-emitting diode (iLED) devices, each comprising an iLED and an iLED substrate separate, independent, and distinct from the pixel substrate, the iLED formed or disposed in, on, or in direct contact with the iLED substrate and electrically connected to and controlled by the pixel controller to emit light, wherein

the one or more iLED devices are disposed in direct contact with the pixel control device and do not extend beyond the pixel controller, and

the pixel controller is disposed in a controller layer and the one or more iLED devices are disposed in an iLED layer different from the controller layer over the pixel controller.

13. The micro-assembled pixel of claim 12, wherein (i) the one or more iLED devices each comprise a broken or separated tether or (ii) the pixel control device comprises a broken or separated tether, or both (i) and (ii).

14. The micro-assembled pixel of claim 12, wherein the iLED substrate comprises a semiconductor iLED substrate or a dielectric iLED substrate.

15. The micro-assembled pixel of claim 14, wherein the pixel control device comprises connection posts electrically connected to the pixel controller.

16. The micro-assembled pixel of claim 14, wherein the iLED substrate comprises a broken or separated tether.

17. The micro-assembled pixel of claim 12, wherein the one or more iLED devices each comprises connection posts electrically connecting the iLED to the pixel controller.

18. The micro-assembled pixel of claim 12, wherein the pixel substrate comprises a semiconductor pixel substrate or a dielectric pixel substrate.

19. The micro-assembled pixel of claim 18, wherein the pixel substrate comprises a broken or separated tether.

20. A method of micro-assembling a pixel, comprising:

providing a pixel control device comprising a pixel substrate and a pixel controller;

providing an iLED source wafer comprising a plurality of iLED devices each comprising an iLED that is disposed or formed in, on, or in direct contact with an iLED substrate separate, independent, and distinct from the pixel substrate;

micro-transfer printing an iLED device from the iLED source wafer onto the pixel substrate of the pixel control device such that the iLED device is in an iLED layer and the pixel control device is in a controller layer different from the iLED layer; and

electrically connecting the iLED of the iLED device to the pixel controller.

21. The method of claim 20, comprising:

providing a pixel control device source wafer having one or more pixel control devices disposed or formed in, on, or in direct contact with the pixel controller source wafer;

micro-transfer printing an iLED device from the iLED source wafer onto each of the one or more pixel control devices; and

electrically connecting each iLED to the corresponding pixel controller on which the LED is micro-transfer printed.

22. The method of claim 20, wherein the iLED device comprises two or more connection posts electrically connected to the iLED and the step of micro-transfer printing the iLED device onto the pixel control device electrically connects the iLED to the pixel controller.

23. The method of claim 20, comprising micro-transfer printing two or more different iLED devices, each from a different iLED source wafer, to the pixel control device and electrically connecting the two or more different iLED devices to the pixel controller.

24. A method of making a high-resolution iLED display, comprising:

providing a display substrate having a display area;

providing a pixel control device source wafer having a plurality of pixel control devices formed or disposed on, in, or in direct contact with the pixel control device source wafer, each of the plurality of pixel control devices comprising a pixel controller formed in or on a pixel substrate;

providing one or more iLED devices for each of the plurality of pixel control devices, wherein each of the one or more iLED devices comprises an iLED;

electrically connecting the one or more iLED devices to each pixel control device, wherein the one or more iLED devices are disposed in direct contact with the pixel substrate of the pixel control device and do not extend beyond the pixel controller;

micro-transfer printing the plurality of pixel control devices from the pixel control device source wafer onto the display substrate in the display area, wherein the plurality of pixel control devices are disposed in a controller layer over the display substrate and the one or more iLED devices disposed on the pixel substrate of each of the plurality of pixel control devices are disposed in an iLED layer different from the controller layer over the display substrate; and

electrically connecting the pixel controller of each of the plurality of pixel control devices to the display substrate.

25. The method of claim 24, wherein each of the plurality of pixel control devices comprises two or more connection posts and the step of micro-transfer printing the plurality of pixel control devices onto the display substrate electrically connects the pixel controller of each of the plurality of pixel control devices to the display substrate.

26. The method of claim 24, comprising:

micro-transfer printing the plurality of pixel control devices onto the display substrate; and

subsequently micro-transfer printing the one or more iLED devices for each of the plurality of pixel control devices onto the pixel control device and electrically connecting to the pixel controller of the pixel control device.

27. The method of claim 24, comprising:

micro-transfer printing the one or more iLED devices for each of the plurality of pixel control devices onto the display substrate;

subsequently micro-transfer printing the pixel control device onto or over the display substrate and electrically connecting the iLED of each of the one or more iLED devices is to the pixel controller of the pixel control device.

28. The method of claim 24, comprising:

micro-transfer printing the one or more iLED devices for each of the plurality of pixel control devices onto the pixel control device;

electrically connecting the iLED of each of the one or more iLED devices to the pixel controller; and

subsequently micro-transfer printing the pixel control device with the one or more iLED devices disposed thereon onto the display substrate.