VAPOR CELL COMPRISING ELECTRO-OPTIC FUNCTION FOR CHIP-SCALE ATOMIC CLOCK, AND METHOD FOR MANUFACTURING SEALED CONTAINER FOR CHIPSCALE INSTRUMENT
First Claim
1. A vapor cell having an electro-optical function for a chip-scale atomic clock, the vapor cell comprising:
- a silicon body having a through-part which is a space where a reactive substance is contained;
a first glass substrate which is disposed on one surface of the silicon body and closes one side of the through-part; and
a second glass substrate which is disposed on the other surface of the silicon body and closes the other side of the through-part,wherein a voltage is applied to the silicon body to control a temperature inside the through-part.
1 Assignment
0 Petitions
Accused Products
Abstract
According to the present invention, since a silicon body itself supporting first and second glass substrates also has a role of an electric heating device, the temperature of the inside of a through-part can be maintained to be constant. In addition, since it is unnecessary to comprise a separate electric heating device such as a heater or to form an additional heating pattern in order to control the temperature of the inside of the through-part, a process for manufacturing a vapor cell can be simplified. According to the present invention, only a reactive material in a gas state and a buffer gas can be injected into a sealed container without the intervention of other materials, and the size of the sealed container can be reduced since it is unnecessary to prepare e separate space for mounting a pill of the reaction material in a vapor cell region itself.
-
Citations
17 Claims
-
1. A vapor cell having an electro-optical function for a chip-scale atomic clock, the vapor cell comprising:
-
a silicon body having a through-part which is a space where a reactive substance is contained; a first glass substrate which is disposed on one surface of the silicon body and closes one side of the through-part; and a second glass substrate which is disposed on the other surface of the silicon body and closes the other side of the through-part, wherein a voltage is applied to the silicon body to control a temperature inside the through-part. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method for manufacturing a sealed container for a chip-scale device, the method comprising the steps of:
-
(A) forming a silicon body on and between opposite ends of a lower glass substrate so as to be partitioned into a vapor cell region and a dispensing region on the lower glass substrate, and providing a channel through which a reactive substance can be communicated between the vapor cell region and the dispensing region; (B) injecting a buffer gas into the vapor cell region and accommodating a reactive substance pill in the dispensing region; (C) sealing the buffer gas from the outside by bonding an upper glass substrate to an upper portion of the silicon body formed at the opposite ends; (D) activating the reactive substance pill to inject the reactive substance of a gaseous state through the channel into the vapor cell region; (E) locally heating a portion of the upper glass substrate which corresponds to the channel to close the channel; and (F) dicing the silicon body formed between the opposite ends, the lower glass substrate and the upper glass substrate adjacent thereto in a height direction of the silicon body formed between the opposite ends. - View Dependent Claims (9, 10, 11, 12)
-
-
13. A method for manufacturing a sealed container for a chip-scale device, the method comprising the steps of:
-
(a) forming a silicon body having an equal height on and between opposite ends of a lower glass substrate so as to be partitioned into a vapor cell region and a dispensing region on the lower glass substrate, and forming a sub silicon body which has a height lower than a height of the silicon body adjacent to the silicon body formed on the opposite ends; (b) depositing a bonding portion on the sub silicon body such that a total height including the height of the sub silicon body and a height of the bonding portion is higher than the height of the silicon body; (c) injecting a buffer gas into the vapor cell region and accommodating a reactive substance pill in the dispensing region; (d) sealing the buffer gas from the outside by bonding an upper glass substrate to an upper portion of the bonding portion; (e) activating the reactive substance pill to inject the reactive substance of a gaseous state into the vapor cell region; (f) melting the bonding portion to bond the upper glass substrate to an upper portion of the silicon body; and (g) dicing the silicon body formed between the opposite ends, the lower glass substrate and the upper glass substrate adjacent thereto in a height direction of the silicon body formed between the opposite ends. - View Dependent Claims (14, 15, 16, 17)
-
Specification