CERAMIC CIRCUIT BOARD AND ELECTRONIC DEVICE

• US 20180213640A1
• Filed: 01/12/2018
• Published: 07/26/2018
• Est. Priority Date: 01/25/2017
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: KAMEI, Takafumi
• Granted Patent: US 10,225,929 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/041 Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 2201/0769 Anti metal-migration, e.g. avoiding tin whisker growth
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/09563 Metal filled via plated through-hole filled with insulating material H05K2201/0959
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/1291 Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A ceramic circuit board includes an insulating substrate composed of stacked insulating layers of an alumina-based sintered body, internal leads containing Cu embedded in the insulating substrate, and one or a plurality of metal layers containing Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to the surface of the insulating substrate in the stacking direction, wherein at least part of the metal layer overlaps the internal leads in plan view.

Claims

1. A ceramic circuit board comprising:

an insulating substrate comprising stacked insulating layers of an alumina-based sintered body;

internal leads comprising Cu embedded in the insulating substrate; and

one or a plurality of metal layers comprising Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to the surface of the insulating substrate in the stacking direction,

wherein at least part of the metal layer overlaps the internal leads in plan view.

2. The ceramic circuit board according to claim 1,

wherein two of the metal layers are disposed on both sides of the internal leads in the stacking direction and the internal leads are interposed therebetween.

3. The ceramic circuit board according to claim 1, comprising a through conductor connected to the metal layer,

wherein the through conductor is embedded in the insulating substrate and passes through the insulating layers in the stacking direction.

4. The ceramic circuit board according to claim 1,

wherein the plurality of metal layers is disposed in line in the stacking direction.

5. The ceramic circuit board according to claim 1,

wherein metal layers adjacent to the internal leads are disposed in the direction orthogonal to the stacking direction.

6. An electronic device comprising:

the ceramic circuit board according to claim 1; and

an electronic component mounted on the ceramic circuit board.

7. The ceramic circuit board according to claim 2, comprising a through conductor connected to the metal layer,

wherein the through conductor is embedded in the insulating substrate and passes through the insulating layers in the stacking direction.

8. The ceramic circuit board according to claim 2,

wherein the plurality of metal layers is disposed in line in the stacking direction.

9. The ceramic circuit board according to claim 3,

wherein the plurality of metal layers is disposed in line in the stacking direction.

10. The ceramic circuit board according to claim 2,

wherein metal layers adjacent to the internal leads are disposed in the direction orthogonal to the stacking direction.

11. The ceramic circuit board according to claim 3,

wherein metal layers adjacent to the internal leads are disposed in the direction orthogonal to the stacking direction.

12. The ceramic circuit board according to claim 4,

wherein metal layers adjacent to the internal leads are disposed in the direction orthogonal to the stacking direction.

13. An electronic device comprising:

the ceramic circuit board according to claim 2; and

an electronic component mounted on the ceramic circuit board.

14. An electronic device comprising:

the ceramic circuit board according to claim 3; and

an electronic component mounted on the ceramic circuit board.

15. An electronic device comprising:

the ceramic circuit board according to claim 4; and

an electronic component mounted on the ceramic circuit board.

16. An electronic device comprising:

the ceramic circuit board according to claim 5; and

an electronic component mounted on the ceramic circuit board.