DEVICE FOR DELAMINATING LAMINATE, DELAMINATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

• US 20180222176A1
• Filed: 04/06/2018
• Published: 08/09/2018
• Est. Priority Date: 10/16/2015
• Status: Active Grant

• Current Assignee: AGC, Inc.
• Original Assignee: Asahi Glass Company, Limited (AGC, Inc.)
• Inventors: Watanabe, Yasuaki, Nakamura, Koji, Kondo, Tsubasa, Ito, Yasunori, Hori, Yuki, Utsugi, Hiroshi
• Granted Patent: US 10,449,755 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 2315/08 Glass
• CPC Class Codes: B32B 2457/202 LCD, i.e. liquid crystal displays
• CPC Class Codes: B32B 2457/204 Plasma displays
• CPC Class Codes: B32B 2457/206 Organic displays, e.g. OLED
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 43/00 Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
• CPC Class Codes: B32B 43/006 Delaminating
• CPC Class Codes: B65H 2301/51122 peeling layer of material
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68386 Separation by peeling
• CPC Class Codes: Y10S 156/93 Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
• CPC Class Codes: Y10S 156/941 Means for delaminating semiconductive product
• CPC Class Codes: Y10T 156/1168 Gripping and pulling work apart during delaminating
• CPC Class Codes: Y10T 156/1978 Delaminating bending means

Abstract

A movable member is gripped in a delamination-start configuration, and the other-end side of a rib of a delamination member is pressed towards the other-end side of a flexible plate. The flexible plate then warps and deforms about the other end side of the flexible plate, which is supported by a support member, the flexible plate deforming along the direction in which delamination progresses. In concert with the delamination action, a reinforcing plate also warps and deforms along with the flexible plate, the reinforcing plate being vacuum-chucked to an air-permeable electroconductive sheet on the flexible plate, and the reinforcing plate is sequentially delaminated from a substrate 2 along the direction in which delamination progresses.

Claims

2. The peeling device of the laminate according to claim 1,

wherein the convex surface of the peeling member has an arc-shaped surface having a constant or continuously changing curvature radius along the peeling proceeding direction.

3. The peeling device of the laminate according to claim 1,

wherein a close-contact member is provided on the convex surface of the peeling member.

4. The peeling device of the laminate according to claim 3, wherein the close-contact member is a sheet-shaped adsorption member or pressure-sensitive adhesive member.

5. The peeling device of the laminate according to claim 3,

wherein the close-contact member includes a plurality of fitting portions to be fitted to a plurality of to-be-fitted portions provided along the counter-adsorption surface of the flexible plate.

6. The peeling device of the laminate according to claim 1, comprising:

a holding member which holds the other substrate of the first substrate and the second substrate; and

a sliding member which slides the holding member in a direction parallel to the other substrate.

7. The peeling device of the laminate according to claim 6,

wherein the sliding member is provided on a coupled portion between a base on which the supporting member is provided and the holding member.

8. A peeling method of a laminate, the laminate comprising a first substrate and a second substrate stuck thereon, the method comprising sequentially peeling off an interface between the first substrate and the second substrate along a peeling proceeding direction from one end portion side toward the other end portion side of the laminate by bending deformation of one substrate of the first substrate and the second substrate,

wherein the peeling method uses:

a flexible plate having an adsorption surface which adsorbs and holds the one substrate;

a peeling member arranged to face a counter-adsorption surface of the flexible plate which is on a side opposite to the adsorption surface, in which a surface of the peeling member facing the counter-adsorption surface is configured as a convex surface, and one end portion side of the peeling member is fixed to one end portion side of the flexible plate and a part of the convex surface is brought into contact with the counter-adsorption surface so that the other end portion side of the peeling member is spaced from the other end portion side of the counter-adsorption surface;

a supporting member which supports the other end portion side of the flexible plate so as to support the flexible plate in a cantilever manner; and

a movable member which moves the other end portion side of the peeling member toward the other end portion side of the counter-adsorption surface, and

wherein the peeling method comprises;

an adsorbing step of adsorbing the one substrate by the adsorption surface of the flexible plate; and

a peeling step of moving the other end portion side of the peeling member toward the other end portion side of the counter-adsorption surface by the movable member so that the flexible plate is subjected to bending deformation along the peeling proceeding direction with the other end portion side of the flexible plate supported by the supporting member as a fulcrum.

9. The peeling method of the laminate according to claim 8,

wherein the convex surface of the peeling member is an arc-shaped surface having a constant or continuously changing curvature radius along the peeling proceeding direction, and

the flexible plate during the peeling step is subjected to bending deformation while being brought into contact with the arc-shaped surface of the peeling member.

10. The peeling method of the laminate according to claim 8,

wherein a close-contact member is provided on the convex surface of the peeling member, and

the flexible plate during the peeling step is subjected to bending deformation while being closely contacted with the close-contact member.

11. The peeling method of the laminate according to claim 8,

wherein, in the peeling step, the other substrate of the first substrate and the second substrate is peeled off while sliding in a direction parallel to the other substrate.

12. A manufacturing method of an electronic device, comprising a functional layer forming process of forming a functional layer on an exposed surface of a first substrate with respect to a laminate comprising the first substrate and a second substrate stuck thereon, and a separating process of separating the second substrate from the first substrate having the functional layer formed thereon,

wherein the separating process uses:

a flexible plate having an adsorption surface which adsorbs and holds one substrate of the first substrate and the second substrate;

a peeling member arranged to face a counter-adsorption surface of the flexible plate which is on a side opposite to the adsorption surface, in which a surface of the peeling member facing the counter-adsorption surface is configured as a convex surface, and one end portion side of the peeling member is fixed to one end portion side of the flexible plate and a part of the convex surface is brought into contact with the counter-adsorption surface so that the other end portion side of the peeling member is spaced from the other end portion side of the counter-adsorption surface;

a supporting member which supports the other end portion side of the flexible plate so as to support the flexible plate in a cantilever manner; and

a movable member which moves the other end portion side of the peeling member toward the other end portion side of the counter-adsorption surface, and

wherein the separating process comprises;

an adsorbing step of adsorbing the one substrate by the adsorption surface of the flexible plate; and

a peeling step of moving the other end portion side of the peeling member toward the other end portion side of the counter-adsorption surface by the movable member so that the flexible plate is subjected to bending deformation along a peeling proceeding direction with the other end portion side of the flexible plate supported by the supporting member as a fulcrum.