MANUFACTURING METHOD OF DISPLAY SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY DEVICE

• US 20180233515A1
• Filed: 05/05/2017
• Published: 08/16/2018
• Est. Priority Date: 05/27/2016
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: CHOI, Seungjn
• Granted Patent: US 10,109,654 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/31105 Etching inorganic layers
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/3213 Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• CPC Class Codes: H01L 27/0251 for MOS devices
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1259 Multistep manufacturing methods

Abstract

A manufacturing method of a display substrate, a display substrate and a display device are provided. The manufacturing method of a display substrate including: forming a first metal pattern; forming a first insulation layer; forming a second metal pattern; forming a second insulation layer forming a first conductive layer; patterning the first conductive layer to form a first conductive pattern; patterning the second insulation layer to form a second insulation pattern; wherein, an orthographic projection of the first conductive pattern on the base substrate and an orthographic projection of the second metal pattern on the base substrate have an overlapping part; and during patterning the second insulation layer, an orthographic projection of the first conductive pattern on the base substrate at least covers the overlapping part.

Claims

1. A manufacturing method of a display substrate, comprising:

forming a first metal pattern on a base substrate;

forming a first insulation layer on the first metal pattern;

forming a second metal pattern on the first insulation layer;

forming a second insulation layer on the second metal pattern;

forming a first conductive layer on the second insulation layer;

patterning the first conductive layer to form a first conductive pattern;

after the first conductive pattern is formed, patterning the second insulation layer to form a second insulation pattern;

wherein,

an orthographic projection of the first conductive pattern on the base substrate and an orthographic projection of the second metal pattern on the base substrate have an overlapping part; and

during patterning the second insulation layer, an orthographic projection of the first conductive pattern on the base substrate at least covers the overlapping part.

2. The manufacturing method of the display substrate according to claim 1, further comprising patterning the first insulation layer to form a first insulation pattern, wherein, during patterning the first insulation layer, an orthographic projection of the first conductive pattern on the base substrate at least covers the overlapping part.

3. The manufacturing method of the display substrate according to claim 2, wherein, the first metal pattern further comprises a first end, the second metal pattern further comprises a second end, the first conductive pattern comprises a first covering portion and a first conductive portion which are independent from each other, an orthographic projection of the first covering portion on the base substrate at least covers the overlapping part;

the first conductive pattern, the second insulation pattern and the first insulation pattern comprise;

a first via hole running through the first conductive layer, the second insulation layer and the first insulation layer and exposing the first end, and a second via hole running though the first conductive layer and the second insulation layer and exposing the second end.

4. The manufacturing method of the display substrate according to claim 3, wherein, patterning the first conductive layer to form the first conductive pattern comprises:

forming a first photoresist layer on the first conductive layer;

exposing and developing the first photoresist layer to form a first photoresist pattern, a removed region of the first photoresist pattern comprising a region corresponding to a position of the first via hole and the second via hole; and

etching the first conductive layer with the first photoresist pattern as a mask to form the first conductive pattern.

5. The manufacturing method of the display substrate according to claim 4, wherein, patterning the second insulation layer to form the second insulation pattern and patterning the first insulation layer to form the first insulation pattern comprise:

etching the second insulation layer with the first photoresist pattern as a mask to form the second insulation pattern;

etching the first insulation layer with the first photoresist pattern as a mask to form the first insulation pattern.

6. The manufacturing method of the display substrate according to claim 5, after the first insulation pattern is formed, further comprising removing the first photoresist pattern.

7. The manufacturing method of the display substrate according to claim 6, after the first photoresist pattern is removed, further comprising forming a second photoresist pattern and patterning the first conductive pattern with the second photoresist pattern as a mask, so as to remove the first covering portion of the first conductive pattern and retain the first conductive portion of the first conductive pattern.

8. The manufacturing method of the display substrate according to claim 7, further comprising removing the second photoresist pattern.

9. The manufacturing method of the display substrate according to claim 3, after the second insulation pattern and the first insulation pattern are formed, further comprising forming a third insulation layer and patterning the third insulation layer to form a third insulation pattern, wherein, the third insulation pattern, the first conductive pattern, the second insulation pattern and the first insulation pattern comprise:

a third via hole running through the third insulation layer, the first conductive layer, the second insulation layer and the first insulation layer in a position corresponding to the first via hole and exposing the first end, and a fourth via hole running through the third insulation layer, the first conductive layer, and the second insulation layer in a position corresponding to the second via hole and exposing the second end.

10. The manufacturing method of the display substrate according to claim 9, after the third insulation pattern is formed, further comprising forming a second conductive pattern, wherein, the second conductive pattern comprises a first connection structure, the first connection structure connects the first end with the second end via the third via hole and the fourth via hole.

11. The manufacturing method of the display substrate according to claim 10, wherein, the first connection structure is connected with parts of the first conductive portion which are disconnected at a position corresponding to the third via hole and the fourth via hole, and the parts of the first conductive portion electrically connect with the first end and the second end through the first connection structure located at the third via hole and the fourth via hole.

12. The manufacturing method of the display substrate according to claim 10, wherein, the display substrate comprises a display area and a peripheral area located on at least one side of the display area, the first metal pattern, the second metal pattern, the first conductive pattern and the second conductive pattern are located in the peripheral area, the display area comprises a gate electrode, a drain electrode, a first electrode and a second electrode, the gate electrode is formed on a same layer as one of the first metal pattern and the second metal pattern, and the drain electrode is formed on a same layer as the other one of the first metal pattern and the second metal pattern, the first electrode and the first conductive pattern are formed on a same layer, and the second electrode and the second conductive pattern are formed on a same layer.

14. The manufacturing method of the display substrate according to claim 12, wherein the display area further comprises a second connection structure formed on a same layer as the second conductive pattern, the second connection structure electrically connects the drain electrode with the first electrode, so as to form a structure in which a pixel electrode is electrically connected with a drain electrode, the second electrode is a common electrode.

15. The manufacturing method of the display substrate according to claim 1, wherein, the display substrate comprises a display area and a peripheral area located on at least one side of the display area, the first metal pattern, the second metal pattern, and the first conductive pattern are located in the display area, the display area comprises a gate line and a data line, one of the first metal pattern and the second metal pattern is the gate line, the other one of the first metal pattern and the second metal pattern is the data line, an orthographic projection of the gate line on the base substrate and an orthographic projection of the data line on the base substrate have the overlapping part.

16. The manufacturing method of the display substrate according to claim 15, after the second insulation pattern is formed, further comprising forming a third insulation layer and patterning the third insulation layer to form a third insulation pattern, wherein, one of the first metal pattern and the second metal pattern further comprises a drain electrode, at least two of the first insulation layer, the second insulation layer and the third insulation layer comprise a fifth via hole at a position corresponding to the drain electrode and exposing the drain electrode.

17. The manufacturing method of the display substrate according to claim 16, after the third insulation pattern is formed, further comprising forming a second conductive pattern;

wherein, the first conductive pattern comprises a common electrode, the second conductive pattern comprises a pixel electrode, the pixel electrode is electrically connected with the drain electrode via the fifth via hole.

18. The manufacturing method of the display substrate according to claim 16, after the third insulation pattern is formed, further comprising forming a second conductive pattern comprising a second connection structure and a common electrode;

the first conductive pattern comprises a second covering portion and a second conductive portion;

during patterning the second insulation layer, an orthographic projection of the second covering portion on the base substrate at least covers the overlapping part;

the second connection structure electrically connects the drain electrode with the second conductive portion via the fifth via hole, so as to form a structure in which a pixel electrode is electrically connected with the drain electrode.

20. The manufacturing method of the display substrate according to claim 1, further comprising forming a fourth insulation pattern located on the second insulation layer, wherein a material of the fourth insulation pattern comprises resin.

21. A display substrate manufactured by the manufacturing method according to claim 1.

22. A display device comprising the display substrate according to claim 21.

13. (canceled)

19. (canceled)