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Apparatus for Optical Fiber-to-Photonic Chip Connection and Associated Methods

  • US 20180239095A1
  • Filed: 02/22/2018
  • Published: 08/23/2018
  • Est. Priority Date: 02/23/2017
  • Status: Active Grant
First Claim
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1. A photonic chip, comprising:

  • a substrate;

    an electrical isolation region formed over the substrate;

    a front end of line region formed over the electrical isolation region, the front end of line region including transistors and electro-optic devices; and

    an optical coupling region defined within a horizontal area extending inward from an edge of the photonic chip, wherein the electrical isolation region and the front end of line region are removed within the optical coupling region,wherein a portion of the substrate is removed within the optical coupling region, and wherein a top surface of a remainder of the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a corresponding plurality of optical fibers, the plurality of grooves formed to extend linearly across the optical coupling region from the edge of the photonic chip, wherein the plurality of grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the front end of line region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.

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