CONNECTABLE SMART LABEL OR TAG, AND METHODS OF MAKING AND CONNECTING THE SAME

• US 20180253632A1
• Filed: 09/20/2017
• Published: 09/06/2018
• Est. Priority Date: 03/03/2017
• Status: Abandoned Application

• Current Assignee: Ensurge Micropower ASA
• Original Assignee: Thin Film Electronics ASA
• Inventors: ULAND, David, BRITTON, Patricia, FISCHER, Peter, CHANDRA, Aditi
• Application Number:
  US15/710,730
• Publication Number:
  US 20180253632A1
• Time in Patent Office: Days
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: H01L 2223/54446 Wireless electrical read out
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/8185 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

A security and/or identification device including an integrated circuit and an antenna or a battery, and methods of manufacturing and using the same, are disclosed. The integrated circuit is on a substrate to be applied, affixed or attached to a package or container, and includes a set of connection pads electrically connectable to an external component, and a memory storing a unique identification number. The antenna or battery may be on the same or a different substrate. The antenna receives a first wireless signal, transmits a second wireless signal, and enables the integrated circuit to extract power from the first wireless signal. The battery provides power to the integrated circuit. The connection pads may be electrically connectable to one or more sensing lines, and the integrated circuit may further include a continuity sensor configured to determine a continuity state of the package/container.

Claims

1. A security and/or identification device, comprising:

a) a first substrate configured to be applied, affixed or attached to a package or container;

b) an integrated circuit on the first substrate, including (i) a first set of connection pads electrically connected to the integrated circuit and configured to be electrically connected to a first component external to the integrated circuit and the first substrate, and (ii) a memory storing a unique identification number for the security and/or identification device; and

c) a second component selected from an antenna and a battery on the first substrate or a second substrate, the antenna being configured to (i) receive a first wireless signal and optionally transmit or broadcast a second wireless signal and (ii) when the battery is absent, enable the integrated circuit to extract power from the first wireless signal, and the battery providing power to the integrated circuit.

2. The security and/or identification device of claim 1, wherein the integrated circuit comprises a continuity sensor electrically connected or coupled to the first set of connection pads, configured to determine a continuity state of the package or container, and the memory includes one or more bits configured to store a value corresponding to the continuity state of the container or package.

3. The security and/or identification device of claim 2, wherein the integrated circuit further comprises one or more additional sets of connection pads electrically connected to the integrated circuit, and the first set of connection pads and the one or more additional sets of connection pads are configured to be electrically connected or coupled to a plurality of sensing lines.

4. The security and/or identification device of claim 1, wherein the second component comprises the antenna.

5. The security and/or identification device of claim 1, wherein the second component comprises the battery.

6. The security and/or identification device of claim 5, further comprising a display on the first substrate, the second substrate or a third substrate, wherein the display is electrically connected to the battery and the integrated circuit, and the integrated circuit is configured to provide data and/or one or more instructions to the display.

7. The security and/or identification device of claim 1, further comprising an adhesive on the first substrate.

8. The security and/or identification device of claim 1, further comprising a pressure-sensitive adhesive or a heat-activated conductive adhesive on the first set of connection pads.

9. The security and/or identification device of claim 1, comprising a near field and/or radio frequency security and/or identification device.

10. The security and/or identification device of claim 1, wherein the integrated circuit comprises one or more printed layers.

11. The security and/or identification device of claim 1, wherein the substrate comprises a plastic or a metal foil, is flexible, and can withstand a processing temperature of up to 200°

C.

12. A method of manufacturing a security and/or identification device, comprising:

a) forming an integrated circuit on a first substrate configured to be applied, affixed or attached to a package or container, the integrated circuit including (i) a first set of connection pads electrically connected to the integrated circuit and configured to be electrically connected to a first component external to the integrated circuit and the first substrate, and (ii) a memory storing a unique identification number for the security and/or identification device; and

b) forming a second component selected from an antenna and a battery on the first substrate or a second substrate, the antenna being configured to (i) receive a first wireless signal and optionally transmit or broadcast a second wireless signal and (ii) when the battery is absent, enable the integrated circuit to extract power from the first wireless signal, and the battery providing power to the integrated circuit.

13. The method of claim 12, wherein the integrated circuit comprises a continuity sensor electrically connected or coupled to the first set of connection pads, the continuity sensor being configured to determine a continuity state of the package or container, and the memory includes one or more bits configured to store a value corresponding to the continuity state of the container or package.

14. The method of claim 13, wherein the integrated circuit further comprises one or more additional sets of connection pads electrically connected to the integrated circuit and configured to be electrically connected or coupled to a plurality of the sensing lines.

15. The method of claim 12, wherein the second component comprises the antenna.

16. The method of claim 12, wherein the second component comprises the battery.

17. The method of claim 12, further comprising depositing an adhesive on the first substrate.

18. The method of claim 12, wherein the security and/or identification device is a near field and/or radio frequency device.

19. The method of claim 12, wherein forming the integrated circuit comprises printing one or more layers of the integrated circuit.

20. The method of claim 12, wherein the first substrate comprises a plastic or a metal foil, is flexible, and can withstand a processing temperature of up to 200°

C.