METHODS AND APPARATUS PROVIDING A GRADED PACKAGE FOR A SEMICONDUCTOR

• US 20180254230A1
• Filed: 06/12/2017
• Published: 09/06/2018
• Est. Priority Date: 03/03/2017
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Revier, Daniel Lee, Cook, Benjamin Stassen
• Granted Patent: US 10,170,384 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 2113/18 Chip packaging
• CPC Class Codes: G06F 2119/18 Manufacturability analysis or optimisation for manufacturability
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/29 characterised by the material , e.g. carbon interlayer dielectrics H01L23/5329
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Methods and apparatus providing a graded package for a semiconductor are disclosed. An example apparatus includes a die; and a graded package encapsulating the die, the graded package including a material that is spatially varied from a first location of the graded package to a second location of the graded package.

Claims

1-8. -8. (canceled)

11. A method comprising:

developing a package grading design for a graded package encapsulating a die;

generating the graded package for the die by spatially varying package material of the graded package based on the package grading design, wherein the generating of the graded package includes;

moving a printhead to a first location of the graded package;

printing at least one of a first material or a first combination of materials at the first location;

moving the printhead to a second location of the graded package; and

printing at least one a second material or a second combination of materials at the second location, the second material being different from the first material and the second combination being different that the first combination.

9. The method of claim 11, wherein the package grading design includes a blueprint for generating the graded package corresponding to a function.

10. The method of claim 9, wherein the function includes at least one of lensing, radiating, electromagnetic shielding, waveguiding, cloaking, or beamsteering.

12. An apparatus comprising:

a package grading designer to develop a package grading design for a graded package encapsulating a die;

a printhead controller to generate the graded package for the die by controlling a printhead to spatially varying package material of the graded package based on the package grading design; and

a package material controller to release the spatially varying package material.

13. The apparatus of claim 12, wherein the package grading design includes a blueprint for generating the graded package corresponding to a function.

14. The apparatus of claim 13, wherein the function includes at least one of lensing, radiating, electromagnetic shielding, waveguiding, cloaking, or beamsteering.

15. The apparatus of claim 12, wherein:

the printhead controller is to move the printhead to a first location of the graded package;

the package material controller is to print at least one of a first material or a first combination of materials at the first location;

the printhead controller is to move the printhead to a second location of the graded package; and

the package material controller is to print at least one a second material or a second combination of materials at the second location, the second material being different from the first material and the second combination being different that the first combination.

16. The apparatus of claim 12, further including a user interface to receive instructions corresponding to the package grading design.

17. (canceled)

20. A tangible non-transitory computer readable storage medium comprising instructions which, when executed, cause a machine to at least:

develop a package grading design for a graded package encapsulating a die;

generate the graded package for the die by spatially varying package material of the graded package based on the package grading design;

move a printhead to a first location of the graded package;

print at least one of a first material or a first combination of materials at the first location;

move the printhead to a second location of the graded package; and

print at least one a second material or a second combination of materials at the second location, the second material being different from the first material and the second combination being different that the first combination.

18. The computer readable medium of claim 20, wherein the package grading design includes a blueprint for generating the graded package corresponding to a function.

19. The computer readable medium of claim 18, wherein the function includes at least one of lensing, radiating, electromagnetic shielding, waveguiding, cloaking, or beamsteering.