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Chip Package Having Die Structures of Different Heights and Method of Forming Same

  • US 20180254260A1
  • Filed: 04/30/2018
  • Published: 09/06/2018
  • Est. Priority Date: 07/02/2015
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a substrate;

    a first chip stack attached to the substrate;

    a second chip stack attached to the substrate, the first chip stack and the second chip stack being attached to a same side of the substrate; and

    a molding compound layer surrounding the first chip stack and the second chip stack, the molding compound layer covering a topmost surface of the first chip stack, a topmost surface of the molding compound layer being substantially coplanar with a topmost surface of the second chip stack.

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