Chip Package Having Die Structures of Different Heights and Method of Forming Same
First Claim
Patent Images
1. A package comprising:
- a substrate;
a first chip stack attached to the substrate;
a second chip stack attached to the substrate, the first chip stack and the second chip stack being attached to a same side of the substrate; and
a molding compound layer surrounding the first chip stack and the second chip stack, the molding compound layer covering a topmost surface of the first chip stack, a topmost surface of the molding compound layer being substantially coplanar with a topmost surface of the second chip stack.
1 Assignment
0 Petitions
Accused Products
Abstract
Structures and formation methods of a chip package are provided. The chip package includes a substrate, a first chip stack attached to the substrate, and a second chip stack attached to the substrate. The first chip stack and the second chip stack being attached to a same side of the substrate. The chip package further includes a molding compound layer surrounding the first chip stack and the second chip stack. The molding compound layer covers a topmost surface of the first chip stack. A topmost surface of the molding compound layer is substantially coplanar with a topmost surface of the second chip stack.
-
Citations
20 Claims
-
1. A package comprising:
-
a substrate; a first chip stack attached to the substrate; a second chip stack attached to the substrate, the first chip stack and the second chip stack being attached to a same side of the substrate; and a molding compound layer surrounding the first chip stack and the second chip stack, the molding compound layer covering a topmost surface of the first chip stack, a topmost surface of the molding compound layer being substantially coplanar with a topmost surface of the second chip stack. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A package comprising:
-
a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface; a first chip stack bonded to the first surface of the substrate; a second chip stack bonded to the first surface of the substrate adjacent the first chip stack, the second chip stack being higher than the first chip stack; and a molding compound layer extending along a topmost surface of the first chip stack, the topmost surface of the first chip stack being a farthest surface of the first chip stack from the substrate. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
-
15. A package comprising:
-
a substrate; a first chip stack bonded to the substrate; a second chip stack bonded to the substrate; an underfill layer extending between the first chip stack and the substrate and between the second chip stack and the substrate, at least a portion of the underfill layer extending along sidewalls of the first chip stack and along sidewalls of the second chip stack; and a package layer over the underfill layer, the package layer extending along a topmost surface of the first chip stack, an interface between the underfill layer and the package layer being above a bottommost surface of the first chip stack and below the topmost surface of the first chip stack. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification