BOLTLESS SUBSTRATE SUPPORT ASSEMBLY
First Claim
1. A substrate support, comprising:
- a conductive baseplate arranged to support a ceramic layer, the conductive baseplate including a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate; and
a coupling assembly arranged within the first cavity, the coupling assembly comprisinga gear configured to rotate about the axis, anda pin arranged within the first cavity, the pin extending along the axis through the gear and into a second cavity below the conductive baseplate, wherein rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate, and wherein the pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity.
1 Assignment
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Accused Products
Abstract
A substrate support includes a conductive baseplate arranged to support a ceramic layer. The conductive baseplate includes a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate. A coupling assembly is arranged within the first cavity. The coupling assembly includes a gear configured to rotate about the axis. A pin arranged within the first cavity extends along the axis through the gear and into a second cavity below the conductive baseplate. Rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate. The pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity.
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Citations
18 Claims
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1. A substrate support, comprising:
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a conductive baseplate arranged to support a ceramic layer, the conductive baseplate including a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate; and a coupling assembly arranged within the first cavity, the coupling assembly comprising a gear configured to rotate about the axis, and a pin arranged within the first cavity, the pin extending along the axis through the gear and into a second cavity below the conductive baseplate, wherein rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate, and wherein the pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 16)
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12. A substrate support, comprising:
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a conductive baseplate arranged to support a ceramic layer, the conductive baseplate including a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate; an insulative baseplate arranged between the conductive baseplate and a lower wall of a substrate processing chamber, the insulative baseplate including a second cavity; and a coupling assembly arranged within the first cavity of the conductive baseplate, the coupling assembly comprising a gear configured to rotate about the axis, and a pin arranged within the first cavity, the pin extending along the axis through the gear and into the second cavity of the insulative baseplate, wherein rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate, and wherein the pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity. - View Dependent Claims (13, 14, 15, 17, 18)
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Specification