OPTICAL MODULATOR

• US 20180275481A1
• Filed: 03/21/2018
• Published: 09/27/2018
• Est. Priority Date: 03/23/2017
• Status: Active Grant

• Current Assignee: Sumitomo Osaka Cement Company Limited
• Original Assignee: Sumitomo Osaka Cement Company Limited
• Inventors: SHINOZAKI, Minoru, SUGAMATA, Toru
• Granted Patent: US 10,416,527 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 6/12007 forming wavelength selective elements, e.g. multiplexer, demultiplexer
• CPC Class Codes: G02F 1/0113 Glass-based, e.g. silica-based, optical waveguides
• CPC Class Codes: G02F 1/0121 Operation of devices; Circuit arrangements, not otherwise provided for in this subclass
• CPC Class Codes: G02F 1/0305 Constructional arrangements G02F1/0327 - G02F1/05 take precedence
• CPC Class Codes: G02F 1/212 Mach-Zehnder type
• CPC Class Codes: G02F 1/2255 controlled by a high-frequency electromagnetic component in an electric waveguide structure
• CPC Class Codes: G02F 2201/505 Arrangements improving the resistance to acoustic resonance like noise
• CPC Class Codes: G02F 2203/15 involving resonance effects, e.g. resonantly enhanced interaction
• CPC Class Codes: H01S 5/02345 Wire-bonding

Abstract

An optical modulator includes an optical modulation element that is accommodated in a housing. A plurality of lead pins, which are electrically connected to the optical modulation element through wire bonding, are fixed to a lateral wall of the housing. Each of the plurality of lead pins includes a portion that protrudes into an inner space (inner surface side) of the housing. A resonance suppressing structure (for example, a concave portion), which is configured to suppress resonance between the lead pins, is provided in a lateral wall portion to which the plurality of lead pins are fixed.

Claims

1. An optical modulator comprising:

an optical modulation element that is accommodated in a housing,

wherein a plurality of lead pins, which are electrically connected to the optical modulation element through wire bonding, are fixed to a lateral wall of the housing,

each of the plurality of lead pins includes a portion that protrudes into an inner space of the housing, and

a resonance suppressing structure, which is configured to suppress resonance between the lead pins, is provided in a lateral wall portion to which the plurality of lead pins are fixed.

2. The optical modulator according to claim 1,

wherein as the resonance suppressing structure, a concave portion or a convex portion, which is formed at least on an inner surface side of the lateral wall portion, is provided.

3. The optical modulator according to claim 2,

wherein as the resonance suppressing structure, a concave portion or a convex portion which is formed on an outer surface side of the lateral wall portion is further provided, and

a position of a step difference in the concave portion or the convex portion is set to be different between the inner surface side and the outer surface side.

4. The optical modulator according to claim 1,

wherein as the resonance suppressing structure, a material, of which at least one of a density and an elastic coefficient is different from at least one of a density and an elastic coefficient of a material of the housing, is disposed at least at a part of the lateral wall portion.

5. The optical modulator according to claim 1,

wherein as the resonance suppressing structure, a vibration absorbing member, which absorbs vibration, is provided at least on an inner surface side of the lateral wall portion.