LOGIC CHIP INCLUDING EMBEDDED MAGNETIC TUNNEL JUNCTIONS
First Claim
1. A magnetic random access memory structure, comprising:
- a first material layer comprising tantalum;
a second material layer on the first material layer, the second material layer comprising platinum and manganese;
a third material layer on the second material layer, the third material layer comprising cobalt and iron;
a fourth material layer on the third material layer, the fourth material layer comprising ruthenium;
a fifth material layer on the fourth material layer, the fifth material layer comprising cobalt, iron and boron, the fifth material layer having a first lateral width;
a tunnel barrier layer on the fifth material layer, the tunnel barrier layer comprising magnesium and oxygen;
a sixth material layer on the tunnel barrier layer, the sixth material layer comprising cobalt, iron and boron;
a seventh material layer above the sixth material layer, the seventh material layer comprising tantalum, and the seventh material layer having a second lateral width less than the first lateral width;
a spacer along sidewalls of the seventh material layer.
1 Assignment
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Accused Products
Abstract
An embodiment integrates memory, such as spin-torque transfer magnetoresistive random access memory (STT-M RAM) within a logic chip. The STT-MRAM includes a magnetic tunnel junction (MTJ) that has an upper MTJ layer, a lower MTJ layer, and a tunnel barrier directly contacting the upper MTJ layer and the lower MTJ layer; wherein the upper MTJ layer includes an upper MTJ layer sidewall and the lower MTJ layer includes a lower MTJ sidewall horizontally offset from the upper MTJ layer. Another embodiment includes a memory area, comprising a MTJ, and a logic area located on a substrate; wherein a horizontal plane intersects the MTJ, a first Inter-Layer Dielectric (ILD) material adjacent the MTJ, and a second ILD material included in the logic area, the first and second ILD materials being unequal to one another. Other embodiments are described herein.
4 Citations
20 Claims
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1. A magnetic random access memory structure, comprising:
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a first material layer comprising tantalum; a second material layer on the first material layer, the second material layer comprising platinum and manganese; a third material layer on the second material layer, the third material layer comprising cobalt and iron; a fourth material layer on the third material layer, the fourth material layer comprising ruthenium; a fifth material layer on the fourth material layer, the fifth material layer comprising cobalt, iron and boron, the fifth material layer having a first lateral width; a tunnel barrier layer on the fifth material layer, the tunnel barrier layer comprising magnesium and oxygen; a sixth material layer on the tunnel barrier layer, the sixth material layer comprising cobalt, iron and boron; a seventh material layer above the sixth material layer, the seventh material layer comprising tantalum, and the seventh material layer having a second lateral width less than the first lateral width; a spacer along sidewalls of the seventh material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A magnetic random access memory structure, comprising:
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a first material layer comprising tantalum; a second material layer on the first material layer, the second material layer comprising platinum and manganese; a third material layer on the second material layer, the third material layer comprising cobalt and iron; a fourth material layer on the third material layer, the fourth material layer comprising ruthenium; a bottom magnetic tunnel junction layer on the fourth material layer, the bottom magnetic tunnel junction layer comprising cobalt, iron and boron, the bottom magnetic tunnel junction layer having a first lateral width; a tunnel barrier layer on the bottom magnetic tunnel junction layer, the tunnel barrier layer comprising magnesium and oxygen; a top magnetic tunnel junction layer on the tunnel barrier layer, the top magnetic tunnel junction layer comprising cobalt, iron and boron; a hardmask above the top magnetic tunnel junction layer, the hardmask comprising tantalum, and the hardmask having a second lateral width less than the first lateral width; a spacer along sidewalls of the hardmask. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification