INTEGRATED CIRCUIT IMPLEMENTED INDUCTORS AND METHODS OF MANUFACTURE
First Claim
Patent Images
1. An integrated circuit comprising:
- a first non-conductive layer;
a first plurality of conductive elements disposed on a first surface of the first non-conductive layer;
a second plurality of conductive elements disposed on a second surface of the first non-conductive layer opposite the first plurality of conductive elements; and
a third plurality of conductive elements disposed through the first non-conductive layer, wherein a first set of the third plurality of conductive elements are disposed radially from a second set of the third plurality of conductive elements, and wherein the first plurality of conductive elements, the second plurality of conductive elements, and the third plurality of conductive elements are selectively coupled in a first conductive path from sequential alternating ones of the first plurality of conductive elements, the first set of the third conductive elements, the second plurality of conductive elements and the second set of the third conductive elements.
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Abstract
An inductor of an integrated circuit can include one or more magnetically transparent and non-conductive layers, a plurality of conductive elements, and a plurality of through hole conductor elements. The plurality of conductive elements can be disposed about opposite sides of each of the one or more non-conductive layers. The plurality of through hole conductive elements can be disposed through the one or more non-conductive layers and electrically coupling selected ones of the plurality of conductive elements in one or more conductive paths configured such that a magnetic field generated in response to a current flow in the one or more conductive paths opposes changes in the current flow.
14 Citations
29 Claims
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1. An integrated circuit comprising:
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a first non-conductive layer; a first plurality of conductive elements disposed on a first surface of the first non-conductive layer; a second plurality of conductive elements disposed on a second surface of the first non-conductive layer opposite the first plurality of conductive elements; and a third plurality of conductive elements disposed through the first non-conductive layer, wherein a first set of the third plurality of conductive elements are disposed radially from a second set of the third plurality of conductive elements, and wherein the first plurality of conductive elements, the second plurality of conductive elements, and the third plurality of conductive elements are selectively coupled in a first conductive path from sequential alternating ones of the first plurality of conductive elements, the first set of the third conductive elements, the second plurality of conductive elements and the second set of the third conductive elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electronic device comprising:
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one or more non-conductive layers; a plurality of conductive elements disposed about opposite sides of each of the one or more non-conductive layers; and a plurality of through hole conductive elements disposed through the one or more non-conductive layers and electrically coupling selected ones of the plurality of conductive elements in one or more conductive paths configured such that a magnetic field generated in response to a current flow in the one or more conductive paths opposes changes in the current flow. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of manufacture comprising:
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depositing a first conductive layer on one or more other layers of an integrated circuit; patterning the first conductive layer to form a first plurality of conductive elements; depositing one or more non-conductive layers on the first plurality of conductive elements; forming a plurality of openings through the one or more non-conductive layers to expose selected portions of each of the first plurality of conductive elements; depositing a second plurality of conductive elements in the opening through the one or more non-conductive layers and electrically coupled to the exposed selected portions of each of the first plurality of conductive elements; depositing a second conductive layer on an exposed one of the one or more non-conductive layers; patterning the second conductive layer to form a third plurality of conductive elements selectively coupled to the second plurality of conductive elements; and wherein the first plurality of conductive elements, the second plurality of conductive elements, and the third plurality of conductive elements are coupled together as a conductive path wrapped about a toroidal polyhedron wherein a first set of the second plurality of conductive elements are disposed about a first perimeter of the toroidal polyhedron and a second set of the second plurality of conductive elements are disposed about a second perimeter of the toroidal polyhedron. - View Dependent Claims (24, 25, 26, 27)
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28. An integrated circuit comprising:
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a first inductor including, a first non-conductive layer; a first plurality of conductive elements disposed on a first surface of the first non-conductive layer; a second plurality of conductive elements disposed on a second surface of the first non-conductive layer opposite the first plurality of conductive elements; and a third plurality of conductive elements disposed through the first non-conductive layer, wherein the first plurality of conductive elements, the second plurality of conductive elements, and the third plurality of conductive elements are selectively coupled in a first conductive path bounding a toroidal polyhedron portion of the first non-conductive layer from sequential alternating ones of the first plurality of conductive elements, the first set of the third conductive elements, the second plurality of conductive elements and the second set of the third conductive elements; and a second inductor of a spiral type inductor, a figure-eight type inductor or a race track type inductor. - View Dependent Claims (29)
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Specification