WIRE OVERMOLD DEVICE AND METHOD OF FORMING WIRE OVERMOLD DEVICE

• US 20180287363A1
• Filed: 02/20/2018
• Published: 10/04/2018
• Est. Priority Date: 03/30/2017
• Status: Active Grant

• Current Assignee: Suzhou Littelfuse Ovs Co., Ltd. (Littelfuse Incorporated)
• Original Assignee: Littelfuse Incorporated
• Inventors: KRUGER, Jay
• Granted Patent: US 10,218,164 B2
• Time in Patent Office: Days
• CPC Class Codes: B60R 16/0215 Protecting, fastening and routing means therefor
• CPC Class Codes: H02G 1/145 Moulds
• CPC Class Codes: H02G 15/043 with end caps, e.g. sleeve closed at one end
• CPC Class Codes: H02G 15/046 with bores or protruding portions allowing passage of cable conductors
• CPC Class Codes: H05K 5/02 Details
• CPC Class Codes: Y10T 29/49172 by molding of insulating material

Abstract

A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.

Claims

1. A method for forming a wire overmold device, the method comprising:

inserting one or more electronic components and at least one of a jacketed cable and one or more wires in a carrier body, the carrier body having a distal end and a proximal end;

at least partially enclosing the at least one of the jacketed cable and the one or more wires between a wire cap and the carrier body;

forming an overmold over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body;

wherein the wire cap and the distal end of the carrier body protrude from the overmold.

2. The method according to claim 1, wherein the carrier body is an elongated semi-cylindrical body having a curved outer surface and a top surface portion.

3. The method according to claim 2, wherein one or more cavities are formed in the top surface portion and extend into the semi-cylindrical body.

4. The method according to claim 2, wherein the wire cap includes a semi-cylindrical body and a top surface portion, the wire cap top surface portion mating with the carrier body top surface portion to enclose the at least one of the jacketed cable and one or more wires.

5. The method according to claim 3, wherein a first cavity formed in the proximal end of the carrier body, the first cavity being configured to receive an electronic component.

6. The method according to claim 3, wherein a second cavity extends from the proximal end of the carrier body, along the semi-cylindrical body, to the distal end of the carrier body, the second cavity being configured to receive a first wire.

7. The method according to claim 6, wherein a third cavity extends from the proximal end of the carrier body, along the semi-cylindrical body, to the distal end of the carrier body, the third cavity being configured to receive a second wire, wherein the second cavity and the third cavity are substantially parallel to each other.

8. The method according to claim 1, wherein the wire cap includes a protrusion, the protrusion being receivable in a corresponding recess in the distal end of the carrier body such that the one or more wires are at least partially enclosed between the wire cap and the distal end of the carrier body.

9. The method according to claim 8, wherein the wire cap includes a curved outer surface, the curved outer surface having a groove for engaging with the overmold.

10. The method according to claim 11, wherein the overmold is formed over a bushing, the bushing being adjacent to the carrier body.