FAN-OUT SENSOR PACKAGE AND OPTICAL FINGERPRINT SENSOR MODULE INCLUDING THE SAME

• US 20180294299A1
• Filed: 12/01/2017
• Published: 10/11/2018
• Est. Priority Date: 04/07/2017
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: BAEK, Yong Ho, CHO, Jung Hyun, KIM, Min Keun, HUR, Young Sik, HAN, Tae Hee
• Granted Patent: US 10,644,046 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 5/208 for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/214 Connecting portions
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14689 MOS based technologies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H10K 59/65 : OLEDs integrated with inorganic image sensors

Abstract

There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Claims

1. A fan-out sensor package comprising:

a connection member having a through-hole;

an image sensor disposed in the through-hole and having an active surface having connection pads and a sensor region disposed thereon and an inactive surface opposing the active surface;

an optical lens disposed on the active surface of the image sensor;

an encapsulant encapsulating at least portions of the connection member, the image sensor, and the optical lens; and

a redistribution layer disposed on the connection member, the image sensor, and the optical lens,

wherein the connection member includes a first wiring layer, and

the redistribution layer electrically connects the first wiring layer and the connection pads to each other.

2. The fan-out sensor package of claim 1, wherein the image sensor is a complementary metal oxide semiconductor (CMOS) image sensor (CIS).

3. The fan-out sensor package of claim 1, further comprising an insulating member disposed on the connection member, the active surface, and the optical lens,

wherein the redistribution layer is disposed in the insulating member.

4. The fan-out sensor package of claim 3, wherein the encapsulant is substantially symmetrical to the insulating member in relation to the connection member.

5. The fan-out sensor package of claim 3, further comprising an infrared cut-off filter disposed on the insulating member.

6. The fan-out sensor package of claim 3, wherein the insulating member has an opening exposing the optical lens.

7. The fan-out sensor package of claim 6, further comprising an infrared cut-off filter disposed in the opening.

8. The fan-out sensor package of claim 3, wherein the redistribution layer is electrically connected to the connection pads through first vias penetrating through at least portions of the insulating member and the encapsulant, and is electrically connected to the first wiring layer through second vias penetrating through at least portions of the insulating member, and

the first vias have a height greater than that of the second vias.

9. The fan-out sensor package of claim 8, wherein the first vias include third vias penetrating through at least portions of the insulating member and fourth vias penetrating through at least portions of the encapsulant, and

the third and fourth vias are connected to each other by via pads disposed on the encapsulant and having a size greater than that of the third and fourth vias.

10. The fan-out sensor package of claim 3, wherein the redistribution layer is electrically connected to the connection pads through first vias penetrating through at least portions of the insulating member and the optical lens, and is electrically connected to the first wiring layer through second vias penetrating through at least portions of the insulating member, and

the first vias have a height greater than that of the second vias.

11. The fan-out sensor package of claim 1, wherein the redistribution layer is in direct contact with the first wiring layer.

12. The fan-out sensor package of claim 11, further comprising an infrared cut-off filter disposed on the connection member, the active surface, and the optical lens,

wherein the redistribution layer is covered with the infrared cut-off filter.

13. The fan-out sensor package of claim 1, wherein the image sensor includes electrode pads disposed on the inactive surface and vias penetrating through a body of the image sensor and connecting the connection pads and the electrode pads to each other, and

the redistribution layer is disposed on the encapsulant, is electrically connected to the first wiring layer through first vias penetrating through at least portions of the encapsulant, and is electrically connected to the electrode pads through second vias penetrating through at least portions of the encapsulant.

14. The fan-out sensor package of claim 1, wherein the connection member includes an insulating layer, the first wiring layer disposed on one surface of the insulating layer, a second wiring layer disposed on the other surface of the insulating layer, and vias penetrating through the insulating layer and electrically connecting the first and second wiring layers to each other, and

the first and second wiring layers are electrically connected to the connection pads.

15. The fan-out sensor package of claim 14, further comprising:

a backside redistribution layer disposed on the encapsulant;

backside vias penetrating through at least portions of the encapsulant and electrically connecting the second wiring layer and the backside redistribution layer to each other; and

a passivation layer disposed on the encapsulant and having openings exposing at least portions of the backside redistribution layer.

16. The fan-out sensor package of claim 15, further comprising electrical connection structures formed in the openings of the passivation layer and electrically connected to the exposed backside redistribution layer.

17. The fan-out sensor package of claim 1, further comprising a passive component disposed in the through-hole and electrically connected to the redistribution layer.

18. The fan-out sensor package of claim 1, wherein the encapsulant covers the inactive surface and side surfaces of the image sensor, and covers at least portions of the active surface of the image sensor.

19. An optical fingerprint sensor module comprising:

the fan-out sensor package of claim 1; and

a display panel disposed on the fan-out sensor package,

wherein the display panel is an organic light emitting diode (OLED) panel.