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PATTERN-EDGE PLACEMENT PREDICTOR AND MONITOR FOR LITHOGRAPHIC EXPOSURE TOOL

  • US 20180299795A1
  • Filed: 06/21/2018
  • Published: 10/18/2018
  • Est. Priority Date: 09/02/2014
  • Status: Active Grant
First Claim
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1. A method for predicting and monitoring a position of an edge of an image of a reticle pattern formed on a workpiece in a lithographic exposure process in an exposure tool, the method comprising:

  • performing at least one wafer-exposure run in the exposure toolto form a first image of the reticle pattern on the workpiece andto determine, with the use of an optical detector of the exposure tool, first and second operational factors, the first operational factors representing parameters of operation of said exposure tool and including descriptors of optical imaging in said exposure tool, the second operational factors representing a shot-overlay characteristic of said exposure tool,wherein the first image is characterized by a first difference between a position of an edge of the first image and a target position;

    determining, with a computer device, a change of a position of an edge of the first image with respect to a target position based on said first operational factors and said second operational factors; and

    modifying, based on a value of the change of the position, the exposure tool by changing one or more of presence, position, orientation, size, and shape of an optical component of the optical projection system to form a second image of the reticle pattern on the workpiece, the second image characterized by a second difference between a position of an edge of the second image and the target position, the second difference being smaller than the first difference.

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