CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INCLUDING THE CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE

• US 20180301280A1
• Filed: 04/11/2018
• Published: 10/18/2018
• Est. Priority Date: 04/17/2017
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: NISHISAKA, YASUHIRO
• Granted Patent: US 10,529,486 B2
• Time in Patent Office: Days
• CPC Class Codes: B22F 1/065 Spherical particles
• CPC Class Codes: B22F 1/102 Metallic powder coated with organic material
• CPC Class Codes: B22F 2007/047 non-pressurised baking of the paste or slurry containing metal powder
• CPC Class Codes: B22F 2301/10 Copper
• CPC Class Codes: B22F 2304/10 Micron size particles, i.e. above 1 micrometer up to 500 micrometer
• CPC Class Codes: C09D 5/24 Electrically-conducting paints conductive materials H01B1/00
• CPC Class Codes: C22C 1/05 Mixtures of metal powder with non-metallic powder C22C1/08 takes precedence
• CPC Class Codes: H01B 1/16 the conductive material comprising metals or alloys
• CPC Class Codes: H01G 4/0085 Fried electrodes
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/2325 characterised by the material of the terminals
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

A conductive paste for an external electrode that includes a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 μm and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. A method of manufacturing an electronic component includes preparing an electronic component element; applying the conductive paste for an external electrode onto an outer surface of the electronic component element; and baking the applied conductive paste to form an external electrode.

Claims

1. A conductive paste for an external electrode, the conductive paste comprising:

a conductive metal powder;

a glass frit having an average particle diameter D50 of not more than 0.8 μ

m and having a flat shape with an average flatness of 1.5 to 5.5; and

a binder resin.

2. The conductive paste for an external electrode according to claim 1, wherein the glass frit contains at least one selected from Ba, Ti, Al, Zn and Sr.

3. The conductive paste for an external electrode according to claim 1, wherein the glass frit contains a B—

Si-based glass.

4. The conductive paste for an external electrode according to claim 3, wherein a shape of the conductive metal powder is spherical.

5. The conductive paste for an external electrode according to claim 4, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μ

m.

6. The conductive paste for an external electrode according to claim 1, wherein a shape of the conductive metal powder is spherical.

7. The conductive paste for an external electrode according to claim 6, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μ

m.

8. The conductive paste for an external electrode according to claim 1, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μ

m.

9. The conductive paste for an external electrode according to claim 1, wherein the binder resin is an acrylic resin.

10. A method for manufacturing an electronic component, the method comprising:

preparing an electronic component element;

applying conductive paste for an external electrode 5 onto an outer surface of the electronic component element, the conductive paste comprising;

a conductive metal powder;

a glass frit having an average particle diameter D50 of not more than 0.8 μ

m and having a flat shape with an average flatness of 1.5 to 5.5; and

a binder resin; and

baking the conductive paste to form an external electrode on the outer surface of the electronic component element.

11. The method for manufacturing an electronic component according to claim 10, further comprising drying the conductive paste on the outer surface of the electronic component element before the conductive paste is baked.

12. The method for manufacturing an electronic component according to claim 10, wherein the glass frit contains at least one selected from Ba, Ti, Al, Zn and Sr.

13. The method for manufacturing an electronic component according to claim 10, wherein the glass frit contains a B—

Si-based glass.

14. The method for manufacturing an electronic component according to claim 13, wherein a shape of the conductive metal powder is spherical.

15. The method for manufacturing an electronic component according to claim 14, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μ

m.

16. The method for manufacturing an electronic component according to claim 10, wherein a shape of the conductive metal powder is spherical.

17. The method for manufacturing an electronic component according to claim 16, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μ

m.

18. The method for manufacturing an electronic component according to claim 10, wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μ

m.

19. The method for manufacturing an electronic component according to claim 10, wherein the binder resin is an acrylic resin.