CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INCLUDING THE CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE
First Claim
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1. A conductive paste for an external electrode, the conductive paste comprising:
- a conductive metal powder;
a glass frit having an average particle diameter D50 of not more than 0.8 μ
m and having a flat shape with an average flatness of 1.5 to 5.5; and
a binder resin.
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Abstract
A conductive paste for an external electrode that includes a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 μm and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. A method of manufacturing an electronic component includes preparing an electronic component element; applying the conductive paste for an external electrode onto an outer surface of the electronic component element; and baking the applied conductive paste to form an external electrode.
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Citations
19 Claims
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1. A conductive paste for an external electrode, the conductive paste comprising:
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a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 μ
m and having a flat shape with an average flatness of 1.5 to 5.5; anda binder resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing an electronic component, the method comprising:
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preparing an electronic component element; applying conductive paste for an external electrode 5 onto an outer surface of the electronic component element, the conductive paste comprising; a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 μ
m and having a flat shape with an average flatness of 1.5 to 5.5; anda binder resin; and baking the conductive paste to form an external electrode on the outer surface of the electronic component element. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification