WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD MANUFACTURING DEVICE

• US 20180302991A1
• Filed: 11/14/2014
• Published: 10/18/2018
• Est. Priority Date: 11/14/2014
• Status: Active Grant

• Current Assignee: Fuji Company Limited
• Original Assignee: Fuji Machine Manufacturing Company Limited
• Inventors: TSUKADA, Kenji, FUJITA, Masatoshi, HASHIMOTO, Yoshitaka, KAWAJIRI, Akihiro, SUZUKI, Masato
• Granted Patent: US 10,462,909 B2
• Time in Patent Office: Days
• CPC Class Codes: B29C 64/112 using individual droplets, e.g. from jetting heads
• CPC Class Codes: B29C 64/124 using layers of liquid which are selectively solidified
• CPC Class Codes: B29C 64/336 of two or more materials
• CPC Class Codes: B29C 64/393 for controlling or regulating additive manufacturing processes
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/3425 Printed circuits
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 50/02 for controlling or regulating additive manufacturing processes
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: B41M 3/006 Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
• CPC Class Codes: B41M 7/0081 using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/097 Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist using ink-jet printing to form a conductive pattern H05K3/125
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/0055 After-treatment, e.g. cleaning or desmearing of holes
• CPC Class Codes: H05K 3/0085 : Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K13/00
• CPC Class Codes: H05K 3/1283 : After-treatment of the printed patterns, e.g. sintering or curing methods

Abstract

A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

Claims

1. A wiring board manufacturing method comprising:

a resin layer forming step of forming a resin layer by applying a UV-curable resin ink and applying UV light to the applied resin ink;

a wiring layer forming step of forming a wiring layer by applying a conductive ink on the resin layer and applying a laser light or a pulse light including a continuous spectrum to the applied conductive ink;

wherein

the wiring board is manufactured by layer building the resin layer and forming the wiring layer by performing the resin layer forming step and the wiring layer forming step in a predetermined order, and

in a case in which the wiring layer forming step is performed directly after performing the resin layer forming step, during the prior resin layer forming step, the UV light is applied such that an integral light amount is a first integral light amount, and

in a case in which another resin layer forming step is performed consecutively directly after performing the resin layer forming step, during at least a portion of the prior resin layer forming step, the UV light is applied such that the integral light amount is a second integral light amount that is smaller than the first integral light amount.

2. The wiring board manufacturing method according to claim 1, wherein the UV light is applied for a first application time as the first integral light amount, and the UV light is applied for a second application time that is shorter than the first application time as the second integral light amount.

3. The wiring board manufacturing method according to claim 1, wherein the UV light is applied with a first UV strength as the first integral light amount, and the UV light is applied for a second UV strength that is weaker than the first UV strength as the second integral light amount.

4. A wiring board manufacturing device for manufacturing a wiring board by performing layer building of a resin layer and forming of a wiring layer, the device comprising:

a first applying means configured to apply a UV-curable resin ink;

a UV light emitting means configured to emit UV light;

a second applying means configured to apply a conductive ink;

a light emitting means configured to emit a laser light or a pulse light including a continuous spectrum; and

a control means configured to perform, in a predetermined order, resin layer forming control for forming the resin layer by applying the resin ink using the first applying means, and applying UV light to the applied resin ink using the UV light emitting means, and wiring layer forming control for forming the wiring layer by applying the conductive ink on the resin layer using the second applying means, and applying laser light or pulse light including a continuous spectrum to the applied conductive ink using the light emitting means.