SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
1. A method for manufacturing a semiconductor package structure comprising:
- providing a first surface mounting element comprises a first chip and a first conductive frame, wherein the first conductive frame comprises a first carrier board and a first metal member, the first carrier board and the first metal member connect with each other to form a first receiving area, the first chip is located in the first receiving area, and a first side of the first chip is electrically connected to the first carrier board;
providing a first circuit board to engage with the first surface mounting element, wherein a second side of the first chip and the first metal member are connected to the first circuit board through a first pad and a second pad respectively; and
providing a second circuit board to connect with the first carrier board, the first surface mounting element is located between the first circuit board and the second circuit board.
1 Assignment
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Accused Products
Abstract
A semiconductor package structure and manufacturing method thereof are provided. Firstly, a first surface mounting unit, a first printed circuit board, and a second printed circuit board are provided. The first surface mounting unit includes a first chip and a first conductive frame, and the first conductive frame has a first carrier board and a first metal member connected to the first carrier board. A first side of the first chip is electrically connected to the first carrier board of the first conductive frame. A second side of the first chip and the first metal member are connected to the first circuit board by a first pad and a second pad respectively. The second circuit board is connected to the first carrier board and hence, the first surface mounting unit is located between the first circuit board and the second circuit board.
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Citations
8 Claims
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1. A method for manufacturing a semiconductor package structure comprising:
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providing a first surface mounting element comprises a first chip and a first conductive frame, wherein the first conductive frame comprises a first carrier board and a first metal member, the first carrier board and the first metal member connect with each other to form a first receiving area, the first chip is located in the first receiving area, and a first side of the first chip is electrically connected to the first carrier board; providing a first circuit board to engage with the first surface mounting element, wherein a second side of the first chip and the first metal member are connected to the first circuit board through a first pad and a second pad respectively; and providing a second circuit board to connect with the first carrier board, the first surface mounting element is located between the first circuit board and the second circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification