SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

• US 20180308781A1
• Filed: 06/29/2018
• Published: 10/25/2018
• Est. Priority Date: 03/04/2016
• Status: Active Grant

• Current Assignee: Niko Semiconductor Co., Ltd
• Original Assignee: Niko Semiconductor Co., Ltd
• Inventors: HSIEH, CHIH-CHENG
• Granted Patent: US 10,297,522 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/8314 Guiding structures outside the body
• CPC Class Codes: H01L 2224/92242 the first connecting process involving a layer connector
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49844 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/92 Specific sequence of method steps
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H02P 27/06 using dc to ac converters or inverters H02P27/05 takes precedence

Abstract

A semiconductor package structure and manufacturing method thereof are provided. Firstly, a first surface mounting unit, a first printed circuit board, and a second printed circuit board are provided. The first surface mounting unit includes a first chip and a first conductive frame, and the first conductive frame has a first carrier board and a first metal member connected to the first carrier board. A first side of the first chip is electrically connected to the first carrier board of the first conductive frame. A second side of the first chip and the first metal member are connected to the first circuit board by a first pad and a second pad respectively. The second circuit board is connected to the first carrier board and hence, the first surface mounting unit is located between the first circuit board and the second circuit board.

Claims

1. A method for manufacturing a semiconductor package structure comprising:

providing a first surface mounting element comprises a first chip and a first conductive frame, wherein the first conductive frame comprises a first carrier board and a first metal member, the first carrier board and the first metal member connect with each other to form a first receiving area, the first chip is located in the first receiving area, and a first side of the first chip is electrically connected to the first carrier board;

providing a first circuit board to engage with the first surface mounting element, wherein a second side of the first chip and the first metal member are connected to the first circuit board through a first pad and a second pad respectively; and

providing a second circuit board to connect with the first carrier board, the first surface mounting element is located between the first circuit board and the second circuit board.

2. The method according to claim 1, wherein the first pad and the second pad are connected to a same surface of the first circuit board.

3. The method according to claim 1, wherein the first surface mounting element further comprises a first enhancing chip connected to the second side of the first chip through a metal layer on the first circuit board.

4. The method according to claim 1, wherein after the step of providing the second circuit board, further comprising:

forming a closed-loop metal ring disposed between the first circuit board and the second circuit board, and the closed-loop metal ring surrounds the first surface mounting element.

5. The method according to claim 1, wherein after the step of providing the second circuit board, further comprising:

coating a fixing paste between the first circuit board and the second circuit board.

6. The method according to claim 1, wherein before the step of providing the first surface mounting element, further comprising:

forming the first metal member on the first conducting frame through one of an etching process, an impact molding process, a binding process, a ball-placing process and a printing process.

7. The method according to claim 1, further comprising:

providing a second surface mounting element including a second chip and a second conductive frame, wherein the second conductive frame includes a second carrier board and a second metal member, the second metal member is connected to the second carrier board to form a second receiving area, and the second chip is disposed in the second receiving area;

fixing the second surface mounting element on the first circuit board;

attaching a side of the second surface mounting element to the second circuit board, wherein the second surface mounting element is located between the first circuit board and the second circuit board.

8. The method according to claim 7, wherein a second side of the second chip is electrically connected to the second carrier board, and the second side of the second chip and the second metal member are connected to the first circuit board through a third pad and a fourth pad respectively.