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SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

  • US 20180308781A1
  • Filed: 06/29/2018
  • Published: 10/25/2018
  • Est. Priority Date: 03/04/2016
  • Status: Active Grant
First Claim
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1. A method for manufacturing a semiconductor package structure comprising:

  • providing a first surface mounting element comprises a first chip and a first conductive frame, wherein the first conductive frame comprises a first carrier board and a first metal member, the first carrier board and the first metal member connect with each other to form a first receiving area, the first chip is located in the first receiving area, and a first side of the first chip is electrically connected to the first carrier board;

    providing a first circuit board to engage with the first surface mounting element, wherein a second side of the first chip and the first metal member are connected to the first circuit board through a first pad and a second pad respectively; and

    providing a second circuit board to connect with the first carrier board, the first surface mounting element is located between the first circuit board and the second circuit board.

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