HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
First Claim
1. A transformer formed in an electrical package comprising:
- a first dielectric layer;
a first conductive loop formed over a surface of the first dielectric layer;
a dielectric spacer formed over the first conductive loop; and
a second conductive loop separated from the first conductive loop by the dielectric spacer layer.
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Accused Products
Abstract
Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.
73 Citations
25 Claims
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1. A transformer formed in an electrical package comprising:
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a first dielectric layer; a first conductive loop formed over a surface of the first dielectric layer; a dielectric spacer formed over the first conductive loop; and a second conductive loop separated from the first conductive loop by the dielectric spacer layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming a transformer in an electrical package, comprising:
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forming a first conductive loop over a first dielectric layer; forming a dielectric spacer layer over the first conductive loop; and forming a second conductive loop in direct contact with the dielectric spacer layer, wherein the first conductive loop is spaced apart from the second conductive loop by only the dielectric spacer layer. - View Dependent Claims (12, 13, 14, 15)
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16. A capacitor formed in an electrical package comprising:
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a first dielectric layer; a first capacitor plate formed over a surface of the first dielectric layer; a dielectric spacer formed over a surface of the first capacitor plate; and a second capacitor plate separated from the first capacitor plate by the dielectric spacer layer. - View Dependent Claims (17, 18, 19, 20)
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21. A method for forming a capacitor in an electrical package, comprising:
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forming a first capacitor plate over a first dielectric layer; forming a dielectric spacer layer over the first capacitor plate; and forming a second capacitor plate in direct by with the dielectric spacer layer, wherein the first capacitor plate is spaced apart from the second capacitor plate by only the dielectric spacer layer. - View Dependent Claims (22, 23, 24, 25)
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Specification