INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNOLOGY
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Abstract
Described is an apparatus which comprises: a die with a first side; a plurality of metal bumps on the first side of the die; a plurality of solders disposed on the plurality of metal bumps; and a patterned printable resist disposed next to at least one of the solders of the plurality of solders. Described is a method which comprises: printing a photoresist ink onto a bumped wafer surface; thermally or Ultra-Violet curing the photoresist ink; and printing or electroplating solder(s) onto the bumped wafer surface. Described is a machine readable storage media having one or more instructions that when executed cause a machine to perform an operations according to the method described above.
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Citations
39 Claims
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1-21. -21. (canceled)
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22. An apparatus comprising:
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a die with a first side; a plurality of metal bumps on the first side of the die; a printable resist disposed next to at least one of the metal bumps on the first side of the die; and a plurality of solders disposed on the plurality of metal bumps. - View Dependent Claims (23, 24, 25, 26, 27)
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28. An apparatus comprising:
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a die with a first side; a plurality of metal bumps on the first side of the die; and a plurality of solders disposed on the plurality of metal bumps, wherein the plurality of metal bumps are positioned according to a patterned printable resist. - View Dependent Claims (29, 30, 31, 32, 33)
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34. A system comprising:
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a memory; a processor coupled to the memory; a package encasing the processor, the package including an apparatus which comprises; a die with a first side; a plurality of metal bumps on the first side of the die; a printable resist disposed next to at least one of the metal bumps on the first side of the die; and a plurality of solders disposed on the plurality of metal bumps; and a wireless interface to allow the processor to communicate with another device. - View Dependent Claims (35, 36, 37, 38, 39)
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Specification