SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES

• US 20180315793A1
• Filed: 06/27/2018
• Published: 11/01/2018
• Est. Priority Date: 06/29/2016
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Zhu, Mingwei, Ganapathiappan, Sivapackia, Fu, Boyi, Ng, Hou T., Patibandla, Nag B.
• Granted Patent: US 10,692,923 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 22/22 Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement testing and repair of stores after manufacture including at wafer scale G11C29/00; fuses per se H01L23/525
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/741 Apparatus for manufacturing means for bonding, e.g. connectors
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages

Abstract

An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

Claims

1-17. -17. (canceled)

18. A method of transferring micro-devices to a destination substrate, comprising:

selectively dispensing adhesive onto selected micro-devices on a donor substrate based on a desired spacing of the selected micro-devices on the destination substrate;

engaging the adhesive on the donor substrate with a transfer surface to cause the selected micro-devices to adhere to the transfer surface; and

transferring each of the selected micro-devices from the donor substrate to the destination substrate using the transfer surface and in accordance to the desired spacing of the selected micro-devices on the destination substrate.

19. The method of claim 18, wherein the micro-devices comprise light emitting diodes.

20. The method of claim 19, further comprising:

optically exciting the light emitting diodes on the donor substrate and detecting one or more defective micro-devices on the donor substrate; and

selectively dispensing the adhesive such that the adhesive is not dispensed on the one or more defective micro-devices and the selected micro-devices does not comprise the one or more defective micro-devices.

21. The method of claim 20, further comprising transferring one or more micro-devices to the transfer surface based on a location of the one or more defective micro-devices.

22. The method of claim 18, wherein the micro-devices are first micro-devices, and the method further comprises

transferring the first micro-devices to the destination substrate;

and

transferring second micro-devices to the destination substrate such that the second micro-devices are adjacent to the first micro-devices, the first micro-devices and the second micro-devices both having the desired spacing on the destination substrate,

wherein the first micro-devices are configured to emit a first color light, and the second micro-devices are configured to emit a second color light.

23. The method of claim 22, wherein a selected first micro-device and a selected second micro-device adjacent to one another define a display pixel for an LED display.

24. The method of claim 18, further comprising stretching the transfer surface to cause the selected micro-devices to have the desired spacing when the transfer surface transfers the selected micro-devices to the destination substrate.

25. The method of claim 18, wherein a spacing of the selected micro-devices on the donor substrate corresponds to the desired spacing of the selected micro-devices on the destination substrate.

26. The method of claim 18, wherein selectively dispensing adhesive comprises ejecting droplets of adhesive onto the micro-devices.

27. The method of claim 18, wherein transferring the selected micro-devices includes:

withdrawing the transfer surface from the donor substrate such that the selected micro-devices detach from the donor substrate and remain adhered by the adhesive to the transfer surface,

lowering the transfer surface toward the destination substrate so that the selected micro-devices engage the destination substrate, and

withdrawing the transfer surface from the destination substrate with the selected micro-devices remaining on the destination substrate.

28. The method of claim 27, comprising neutralizing the adhesive before withdrawing the transfer surface from the destination substrate.

29. The method of claim 28, wherein neutralizing the adhesive comprises denaturing the adhesive.

30. The method of claim 29, wherein denaturing the adhesive comprises illuminating the adhesive.

31. The method of claim 29, wherein denaturing the adhesive comprises heating the adhesive.

32. The method of claim 28, wherein neutralizing the adhesive comprises removing the adhesive.

33. The method of claim 32, wherein removing the adhesive comprises dissolving or melting the adhesive.

34. The method of claim 18, wherein the transfer surface comprises a roller to receive the selected micro-devices from the donor substrate.

35. The method of claim 18, wherein the transfer surface comprises a planar surface to receive the selected micro-devices from the donor substrate.