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METHOD OF INSPECTING A SPECIMEN AND SYSTEM THEREOF

  • US 20180321299A1
  • Filed: 07/02/2018
  • Published: 11/08/2018
  • Est. Priority Date: 03/25/2015
  • Status: Active Grant
First Claim
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1. A die layout clipping unit, the unit comprising:

  • an I/O interface configured to receive, from at least one computer-based and online connected inspection unit, a first data indicative of location information of a potential defect of interest revealed in a specimen and of one or more inspected layers corresponding to the potential defect of interest; and

    a processor operatively connected to the I/O interface and configured to generate a die layout clip in accordance with the first data, the die layout clip comprising information indicative of one or more patterns characterizing an inspection area,wherein the I/O interface is further configured to transmit the generated die layout clip to the at least one inspection unit.

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