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POWER MODULE

  • US 20180323120A1
  • Filed: 11/01/2016
  • Published: 11/08/2018
  • Est. Priority Date: 11/12/2015
  • Status: Active Grant
First Claim
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1. A power module comprising:

  • an insulating substrate having an upper surface on which a semiconductor element is mounted;

    a base plate joined to a lower surface of the insulating substrate;

    a case member surrounding the insulating substrate and adhered to the base plate;

    a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and

    a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being sealed in the sealing resin.

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