CONDENSATION REACTION-TYPE DIE BONDING AGENT, LED LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

• US 20180323355A1
• Filed: 01/13/2017
• Published: 11/08/2018
• Est. Priority Date: 01/15/2016
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited, Citizen Watch Co Limited (Citizen Electronics Company Limited)
• Original Assignee: Citizen Electronics Company Limited, Citizen Watch Co Limited (Citizen Electronics Company Limited)
• Inventors: Kajiwara, Hiroo, Ogawa, Yuji, Sato, Kenichiro, Yaguchi, Yuta
• Granted Patent: US 10,461,232 B2
• Time in Patent Office: Days
• CPC Class Codes: C08G 77/16 to hydroxyl groups
• CPC Class Codes: C08G 77/18 to alkoxy or aryloxy groups
• CPC Class Codes: C08K 5/0091 Complexes with metal-heteroatom-bonds
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A condensation reaction-type die bonding agent has little liability of poor electrical connection at the electrodes. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, where the die bonding agent includes (A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (T_A) expressed by R¹SiO_3/2 where, R¹ indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups, (B) a polysilsesquioxane liquid in state at room temperature having trisiloxy units (T_B) expressed by R²SiO_3/2 where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —OR² where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and (C) a condensation reaction catalyst.

Claims

1. A condensation reaction-type die bonding agent for bonding an LED device provided on its surface with device electrodes having connection surfaces covered by gold, said die bonding agent comprising:

(A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (T_A) expressed by R¹SiO_3/2 where, R¹ indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups;

(B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (T_B) expressed by R²SiO_3/2 where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —

OR² where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group; and

(C) a condensation reaction catalyst.

2. The condensation reaction-type die bonding agent according to claim 1, wherein a softening point of the (A) component is 40 to 150°

C.

3. The condensation reaction-type die bonding agent according to claim 1, wherein a viscosity of the (B) component is 5 to 10,000 mPa·

s/25°

C.

4. b The condensation reaction-type die bonding agent according to claim 1, further comprising (D) an inorganic filler.

5. A method for manufacturing an LED light emitting device comprising the steps of:

using a die bonding agent to bond an LED device provided on its surface with device electrodes having connection surfaces covered by gold to a surface of a mounting substrate having substrate electrodes;

connecting said substrate electrodes and said connection surfaces of said device electrodes by conductive interconnect members; and

sealing said LED device by a sealing member, wherein

said die bonding agent is a condensation reaction type bonding agent comprising;

(A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (T_A) expressed by R¹SiO_3/2 where, R¹ indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups,

(B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (T_B) expressed by R²SiO_3/2 where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —

OR² where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and

(C) a condensation reaction catalyst.

6. The method for manufacturing an LED light emitting device according to claim 5 wherein the (C) condensation reaction catalyst is at least one catalyst selected from the group comprising compounds of magnesium, aluminum, tin, zinc, iron, cobalt, nickel, zirconium, cerium, titanium, and other metals.

7. The method for manufacturing an LED light emitting device according to claim 6 wherein the (C) condensation reaction catalyst does not comprise free carboxylic acid.

8. An LED light emitting device comprising:

a mounting substrate having substrate electrodes;

an LED device provided on its surface with device electrodes having connection surfaces covered with gold;

a bonding member for bonding a front surface of said mounting substrate and a back surface of said LED device;

conductive interconnect members with one ends connected to said substrate electrodes and with other ends connected to the connection surfaces of said device electrodes; and

a sealing member for sealing said LED device, wherein

said bonding member is obtained by a condensation reaction of

(A) a polysilsesquioxane solid in state at room temperature having trisiloxy units (T_A) expressed by R¹SiO_3/2 where, R¹ indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having hydroxyl groups,

(B) a polysilsesquioxane liquid in state at room temperature having 65 mol % to 100 mol % trisiloxy units (T_B) expressed by R²SiO_3/2 where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and having —

OR² where, R² indicates one group selected from the group comprised of C1 to C15 alkyl groups, a phenyl group, and a benzyl group, and

(C) a condensation reaction catalyst.

9. The LED light emitting device according to claim 8, wherein the (C) condensation reaction catalyst is at least one catalyst selected from the group comprising compounds of magnesium, aluminum, tin, zinc, iron, cobalt, nickel, zirconium, cerium, titanium, and other metals.

10. The LED light emitting device according to claim 9, wherein the (C) condensation reaction catalyst does not comprise free carboxylic acid.