DISPLAY MODULE, DISPLAY APPARATUS HAVING THE SAME, AND FABRICATING METHOD THEREOF

• US 20180329254A1
• Filed: 08/04/2016
• Published: 11/15/2018
• Est. Priority Date: 08/04/2016
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Wang, Zifeng, Ren, Yan, Cao, Lei, Hu, Nannan, Lin, She
• Granted Patent: US 10,459,266 B2
• Time in Patent Office: Days
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/133314 Back frames
• CPC Class Codes: G02F 1/133331 Cover glasses
• CPC Class Codes: G02F 1/133388 with constructional differences between the display region and the peripheral region
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 2202/28 Adhesive materials or arrangements
• CPC Class Codes: H05K 5/03 Covers
• CPC Class Codes: H10K 59/871 Self-supporting sealing arrangements
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

The present application discloses a display module including a display substrate having a display area and a peripheral area surrounding the display area; a packaging cover facing the display substrate; and a mold frame having a frame shape and configured to receive the display substrate and the packaging cover. In the present display module, the mold frame includes a main body and a protrusion protruding away from an inner surface of the mold frame, the protrusion is between the display substrate and the packaging cover; the packaging cover has a recess in an area corresponding to the protrusion for receiving the protrusion; the recess and the protrusion complementarily match each other; and the protrusion has a first surface abutting the peripheral area of the display substrate and a second surface opposite to the first surface, the second surface abutting a surface of the recess.

Claims

1. A display module, comprising;

a display substrate having a display area and a peripheral area surrounding the display area;

a packaging cover facing the display substrate; and

a mold frame having a frame shape and configured to receive the display substrate and the packaging cover;

wherein the mold frame comprises a main body and a protrusion protruding away from an inner surface of the mold frame, the protrusion is between the display substrate and the packaging cover;

the packaging cover has a recess in an area corresponding to the protrusion for receiving the protrusion;

the recess and the protrusion complementarily match each other; and

the protrusion has a first surface abutting the peripheral area of the display substrate and a second surface opposite to the first surface, the second surface abutting a surface of the recess.

2. The display module of claim 1, wherein the protrusion partitions the inner snake into a first portion and a second portion;

the display module further comprising;

a sealant between the first portion of the inner surface and the display substrate, and a sealant between the second portion of the inner surface and the packaging cover, for sealing the display substrate and the packaging cover together and encapsulating display elements therebetween.

3. The display module of claim 2, wherein an inner cover surface of the packaging cover abuts an inner substrate surface of the display substrate facing the inner cover surface;

the inner cover surface and a surface of the recess are connected through a side surface of the recess.

4. The display module of claim 3, wherein the first surface of the protrusion is substantially level with the inner cover surface of the packaging cover.

5. The, display module of claim 3, wherein the inner substrate surface is adhered to the first surface of the protrusion and the inner cover surface by an adhesive, and the second surface of the protrusion is adhered to the packaging cover by an adhesive.

6. The display module of claim 3, wherein the protrusion has a third surface connecting the first surface and the second surface, the third surface facing the side surface of the recess and configured to form a gap therebetween.

7. The display module of claim 3, further comprising a printed circuit board assembly in a printed circuit board assembly area corresponding to an area within the peripheral area;

the printed circuit board assembly comprises a printed circuit board abutting the inner substrate surface, a flexible connector, and an interface;

a maximum thickness of the display module in the printed circuit board assembly area is no more than a maximum thickness of the display module in areas other than the printed circuit board assembly area.

8. The display module of claim 7, the packaging cover has a cut-out section corresponding to the printed circuit board assembly area.

9. The display module of claim 7, further comprising a back cover on a side of the printed circuit board assembly distal to the display substrate.

10. The display module of claim 7, the maximum thickness of the display module in areas other than the printed circuit board assembly area is defined by a maximum thickness of the mold frame along a direction substantially perpendicular to the first surface and the second surface of the protrusion.

11. The display module of claim 1, further comprising a circular polarizer on a side of the display substrate distal to the packaging cover.

12. The display module of claim 11, wherein a maximum thickness of display module in an area corresponding to the display area is substantially the same as a sum of thicknesses of the display substrate, the packaging cover, and the circular polarizer.

13. A display apparatus comprising a display module of claim 1.

16. The method of claim 1, wherein the step of assembling the mold frame, the packaging cover, and the display substrate comprises:

adhering a first surface of the protrusion onto the peripheral area of the display substrate, to receive the display substrate in the mold flame;

adhering a second surface of the protrusion onto the surface of the recess, to receive the packaging cover in the mold frame, and to receive the protrusion in the recess;

the second surface opposite to the first surface; and

adhering an inner cover surface of the packaging cover onto an inner substrate surface of the display substrate &

ring the inner cover surface;

the inner cover surface and a surface of the recess are connected through a side surface of the recess.

14. A method of fabricating a display module, comprising:

providing a mold frame comprising a main body and a protrusion protruding away from an inner surface of the mold frame;

providing a packaging cover having a recess complementary to the protrusion;

providing a display substrate having a display area and a peripheral area surrounding the display area; and

assembling the mold frame, the packaging cover, and the display substrate so that the protrusion is sandwiched by the display substrate and the packaging cover, and the recess and the protrusion complementarily match each other.

15. The method of claim 14, wherein the display substrate, the packaging cover, and the mold frame are assembled together so that the protrusion has a first surface abutting the peripheral area of the display substrate and a second surface opposite to the first surface, the second surface abutting a surface of the recess.

17. The method of claim 14, subsequent to the assembling step, further comprising encapsulating display elements between the display substrate and the packaging cover by sealing a space formed among the mold frame, the display substrate, and the packaging cover.

18. The method of claim 17, wherein the protrusion partitions the inner surface into a first portion and a second portion;

wherein the encapsulating step comprises sealing a gap between the first portion of the inner surface and the display substrate and sealing a gap between the second portion of the inner surface and the packaging cover.

19. The method of claim 14, further comprising attaching a primed circuit board assembly in a printed circuit board assembly area corresponding to an area within the peripheral area.

20. The method of claim 19, further comprising fabricating the packaging cover having the recess complementary to the protrusion and a cut-out portion corresponding to the printed circuit board assembly area.