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REAL TIME MONITORING WITH CLOSED LOOP CHUCKING FORCE CONTROL

  • US 20180330926A1
  • Filed: 05/15/2018
  • Published: 11/15/2018
  • Est. Priority Date: 05/15/2017
  • Status: Active Grant
First Claim
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1. A method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber, the method comprising:

  • placing a workpiece on an electrostatic chuck in a processing chamber;

    striking a plasma within the processing chamber;

    monitoring a deflection force on the workpiece;

    applying a chucking voltage at a minimum value;

    applying a backside gas pressure at a minimum pressure;

    adjusting the chucking voltage and or backside gas pressure such that the deflection force is less than a threshold value; and

    simultaneously ramping up the chucking voltage and the backside gas pressure.

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