LOUDSPEAKER ARRANGEMENT

• US 20180332403A1
• Filed: 06/25/2018
• Published: 11/15/2018
• Est. Priority Date: 02/28/2017
• Status: Active Grant

• Current Assignee: Usound GmbH
• Original Assignee: Usound GmbH
• Inventors: RUSCONI CLERICI BELTRAMI, ANDREA, BOTTONI, FERRUCCIO
• Granted Patent: US 10,516,948 B2
• Time in Patent Office: Days
• CPC Class Codes: H04R 1/025 Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
• CPC Class Codes: H04R 1/227 using transducers reproducing the same frequency band
• CPC Class Codes: H04R 1/24 Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/02 Loudspeakers H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H04R 3/12 for distributing signals to two or more loudspeakers specially adapted for hearing aids H04R25/407

Abstract

A loudspeaker arrangement for a plurality of MEMS loudspeakers for generating sound waves in the audible wavelength spectrum includes a housing, which has a sound conduction cavity and at least one sound outlet opening, and at least two MEMS loudspeakers, arranged in the interior of the housing opposite and spaced apart from each other by the sound conduction cavity. Each MEMS loudspeaker has a cavity in the region of their opposite faces. The loudspeaker arrangement includes a shielding wall for acoustically decoupling the two MEMS loudspeakers from each other. The shielding wall is arranged in the interior of the housing between the two MEMS loudspeakers such that the sound conduction cavity is subdivided into a first and a second a cavity region respectively associated with one of the two MEMS loudspeakers.

Claims

1. Loudspeaker arrangement for multiple MEMS loudspeakers for generating sound waves in the audible wavelength spectrum, comprising:

a housing defining an interior that includes a sound-conducting hollow, the housing defining at least one sound outlet at one end of the housing;

at least two MEMS loudspeakers, which are arranged opposite each other and spaced apart from each other in the interior of the housing and extend longitudinally through the sound-conducting hollow, each MEMS loudspeaker includes a cavity facing away from the like cavity of the other MEMS loudspeaker;

a shielding wall for acoustically decoupling the two MEMS loudspeakers from each other, the shielding wall being arranged in the interior of the housing between the two MEMS loudspeakers, in such a manner that the sound-conducting hollow is subdivided into a first hollow plenum and a second hollow plenum, each hollow plenum being disposed between the shielding wall and a respective one of the two MEMS loudspeakers, wherein the shielding wall extends across the full length and width of the two MEMS loudspeakers.

2. Loudspeaker arrangement according to claim 1, wherein the sound-conducting hollow defines a first inner side surface at one end of the sound-conducting hollow disposed opposite to the sound outlet, wherein the shielding wall extends longitudinally in a direction generally parallel to the two MEMS loudspeakers and over a length extending from at least the first inner side surface of the sound-conducting hollow toward the sound outlet of the sound-conducting hollow.

3. Loudspeaker arrangement according to claim 1, wherein the sound-conducting hollow defines a first inner side surface at one end of the sound-conducting hollow disposed opposite to the sound outlet, wherein the shielding wall extends longitudinally in a direction generally parallel to the two MEMS loudspeakers and over a length extending from at least the first inner side surface of the sound-conducting hollow to at least beyond the ends of the two MEMS loudspeakers closest to the sound outlet of the sound-conducting hollow.

4. Loudspeaker arrangement according to claim 1, wherein an edge area of the shielding wall is arranged on the inner surface of the sound-conducting hollow in an acoustically sealing manner.

5. Loudspeaker arrangement according to claim 1, wherein the housing defines a sound-conducting channel extending between the sound outlet and the two hollow plenums and configured so that the sound waves emanating from each respective MEMS loudspeaker are brought together.

6. Loudspeaker arrangement according to claim 5, wherein the sound-conducting channel is connected at its one end to the sound-conducting hollow, and at its other end to the sound outlet, and extends in a straight line therebetween.

7. Loudspeaker arrangement according to claim 1, wherein the shielding wall extends from the first inner side surface to the sound-conducting channel.

8. Loudspeaker arrangement according to claim 1, wherein the shielding wall extends from the first inner side surface and at least partially into the sound-conducting channel.

9. Loudspeaker arrangement according to claim 1, wherein each of the shielding wall and the sound-conducting channel is arranged in the middle of the housing about an axis of symmetry of the housing.

10. Loudspeaker arrangement according to claim 1, wherein each of the shielding wall and the sound-conducting channel is arranged in a manner coaxial relative to each other.

11. Loudspeaker arrangement according to claim 1, wherein the thickness of the shielding wall is smaller than the width of the sound-conducting channel.

12. Loudspeaker arrangement according to claim 1, wherein the shielding wall and the housing are produced in one piece from silicon.

13. Loudspeaker arrangement according to claim 1, wherein the shielding wall and the housing are separate components, and the edge area of the shielding wall is connected to the housing in a positively locking manner.

14. Loudspeaker arrangement according to claim 1, wherein the shielding wall and the housing are separate components, and the edge area of the shielding wall is connected to the housing in a force-fitting manner.

15. Loudspeaker arrangement according to claim 1, wherein the shielding wall and the housing are separate components, and the edge area of the shielding wall is connected to the housing in a firmly bonded manner.

16. Loudspeaker arrangement according to claim 1, wherein the material forming the shielding wall features a stiffness that is higher compared to the stiffness of the material forming the housing.

17. Loudspeaker arrangement according to claim 16, wherein the housing is made of silicon and the shielding wall is made of a material having a relatively higher stiffness and selected from the group consisting of:

metal, aluminum, a ceramic material and a composite material.

18. Loudspeaker arrangement according to claim 1, wherein the cavity of at least one MEMS loudspeaker is formed by a carrier substrate hollow of the MEMS loudspeaker.