LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
First Claim
1. A light-emitting device, comprising:
- a light-emitting element, comprising a top surface, a bottom surface, and a side surface between the top surface and the bottom surface;
a wavelength conversion layer, covering the top surface, and comprising a plurality of wavelength conversion particles with an equivalent particle diameter D50;
a light pervious element, comprising a recess structure and an outer wall, and disposed on the wavelength conversion layer; and
a light-reflecting enclosure surrounding the outer wall,wherein the D50 is not great than 10 μ
m, andwherein the recess structure is laterally overlapped with the side surface of the light-emitting element and the wavelength conversion layer.
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Accused Products
Abstract
A light-emitting device includes a light-emitting element, a wavelength conversion layer, a light pervious element and a light-reflecting enclosure. The light-emitting element includes a top surface, a bottom surface, and a side surface between the top surface and the bottom surface. The wavelength conversion layer covers the top surface of the light-emitting element, and includes a plurality of wavelength conversion particles having an equivalent particle diameter D50. The light pervious element includes a recess structure and an outer wall. The light-reflecting enclosure surrounds the outer wall. The D50 of the wavelength conversion particles is not great than 10 μm. The recess structure is laterally overlapped with the side surface of the light-emitting element and the wavelength conversion layer.
4 Citations
13 Claims
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1. A light-emitting device, comprising:
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a light-emitting element, comprising a top surface, a bottom surface, and a side surface between the top surface and the bottom surface; a wavelength conversion layer, covering the top surface, and comprising a plurality of wavelength conversion particles with an equivalent particle diameter D50; a light pervious element, comprising a recess structure and an outer wall, and disposed on the wavelength conversion layer; and a light-reflecting enclosure surrounding the outer wall, wherein the D50 is not great than 10 μ
m, andwherein the recess structure is laterally overlapped with the side surface of the light-emitting element and the wavelength conversion layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification