LID COVER SPRING DESIGN

• US 20180350716A1
• Filed: 05/01/2018
• Published: 12/06/2018
• Est. Priority Date: 06/05/2017
• Status: Active Grant

• Current Assignee: Microsemi Corporation (Microchip Technology Incorporated)
• Original Assignee: Microsemi Corporation (Microchip Technology Incorporated)
• Inventors: Samples, Benjamin A., May, John Fredrick
• Granted Patent: US 10,522,443 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence

Abstract

A module package can include a substrate; at least one device component configured to be positioned on the substrate; a module package lid configured to be positioned over the at least one device component and on the substrate, the module package lid exhibiting a plateau portion; and at least one mounting spring configured to be positioned on the module package lid, wherein the at least one mounting spring is configured to be mechanically coupled with a mounting surface and further positionally secure the module package lid and the at least one device component. Each mounting spring can include a middle portion; an end portion having a mounting hole; and a curved section between the middle portion and the end portion, the middle portion arranged to mate with the plateau portion of the module package lid when the end portion are secured to the substrate, the curved section being configured to prevent contact with a first corner portion of the module package lid.

Claims

1. A module package, comprising:

a substrate;

at least one device component configured to be positioned on the substrate;

a module package lid configured to be positioned over the at least one device component and on the substrate, the module package lid exhibiting a plateau portion; and

at least one mounting spring configured to be positioned on the module package lid, wherein the at least one mounting spring is configured to be mechanically coupled with a mounting surface and further positionally secure the module package lid and the at least one device component, each mounting spring having;

a middle portion;

an end portion having a mounting hole; and

a curved section between the middle portion and the end portion, the middle portion arranged to mate with the plateau portion of the module package lid when the end portion are secured to the substrate, the curved section being configured to prevent contact with a first corner portion of the module package lid.

2. The module package of claim 1, wherein the first corner portion of the module package lid is curved to prevent engagement with the at least one mounting spring.

3. The module package of claim 1, further comprising a cover configured to be positioned over the package lid and the at least one mounting spring.

4. The module package of claim 1, wherein the at least one mounting spring is made of stainless steel, titanium, or a non-metallic material.

5. The module package of claim 1, further comprising a mounting screw configured to secure the at least one mounting spring to the mounting surface via the mounting hole.

6. The module package of claim 1, wherein the mounting surface is a heat sink.

7. The module package of claim 1, wherein the package lid plateau includes at least one positioning lid configured to engage with a corresponding positioning hole on each mounting spring.

8. The module package of claim 1, wherein the module package is a radio frequency (RF) power module package.

9. A method of assembling a module package, comprising:

positioning at least one device component on a substrate;

positioning a module package lid over the at least one device component and on the substrate;

positioning at least one mounting spring on the module package lid; and

securing the at least one mounting spring to a mounting surface, the at least one mounting spring having a middle portion, an end portion having a mounting hole, and a curved section between the middle portion and the plateau portion, wherein the curved section is configured to prevent contact with a first corner portion of the module package lid.

10. The method of claim 9, further comprising positioning the substrate on the mounting surface.

11. The method of claim 9, further comprising positioning a cover over the package lid and the at least one mounting spring.

12. The method of claim 11, further comprising securing the cover to the package lid.

13. The method of claim 9, wherein securing the at least one mounting spring to the mounting surface includes using a mounting screw to couple the at least one mounting spring and the mounting surface via the mounting hole.

14. The method of claim 9, wherein positioning the at least one mounting spring on the package lid includes aligning a positioning hole of the at least one mounting spring with a corresponding positioning pin of the package lid.

15. The method of claim 9, wherein the first corner portion of the module package lid is curved to prevent engagement with the at least one mounting spring.

16. The method of claim 9, wherein the at least one mounting spring includes a single component comprising four curved sections and four mounting holes for the securing.

17. The method of claim 9, wherein the mounting surface is a heat sink.

18. The method of claim 9, wherein the at least one mounting spring is made of stainless steel, titanium, or a non-metallic material.

19. The module package of claim 18, wherein the module package is a radio frequency (RF) power module package.

20. A module package assembled by way of the method of claim 9.