HIGH-POWER LIGHT-EMITTING DIODE AND LIGHT-EMITTING MODULE HAVING THE SAME
First Claim
1. A light emitting diode, comprising:
- a gallium nitride substrate;
a first conductivity-type semiconductor layer disposed on the gallium nitride substrate;
a mesa comprising a second conductivity-type semiconductor layer disposed on the first conductivity-type semiconductor layer and an active layer interposed between the second conductivity-type semiconductor layer and the first conductivity-type semiconductor layer;
a first contact layer comprising an outer contact portion disposed along a circumference of the mesa and contacting the first conductivity-type semiconductor layer near an edge of the gallium nitride substrate and a plurality of inner contact portions disposed in a region surrounded by the outer contact portion and contacting the first conductivity-type semiconductor layer;
a second contact layer disposed on the mesa and contacting the second conductivity-type semiconductor layer;
is an upper insulation layer having a first opening overlapping the first contact layer and a second opening overlapping the second contact layer;
a first electrode pad electrically connected to the first contact layer through the first opening; and
a second electrode pad electrically connected to the second contact layer through the second opening,wherein the light emitting diode is capable of operating at a current density of 150 A/cm2 or more and has a maximum junction temperature of 180°
C. or more.
2 Assignments
0 Petitions
Accused Products
Abstract
A light-emitting diode includes: a gallium nitride substrate; a first semiconductor layer disposed thereon; a mesa including a second semiconductor layer disposed on the first semiconductor layer and an intervening active layer; a first contact layer including an outer contact part in contact with the first semiconductor layer near an edge of the substrate and an inner contact part in contact with the first semiconductor layer within a region encompassed by the outer contact part; a second contact layer disposed on the mesa in contact with the second semiconductor layer; an upper insulation layer having first and second opening parts overlapping the first and second contact layers; and first and second electrode pads electrically connected to the first and second contact layers through the first and second opening parts, wherein the LED can be driven at 150 A/cm2 or more and has a maximum junction temperature of 180° C. or more.
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Citations
20 Claims
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1. A light emitting diode, comprising:
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a gallium nitride substrate; a first conductivity-type semiconductor layer disposed on the gallium nitride substrate; a mesa comprising a second conductivity-type semiconductor layer disposed on the first conductivity-type semiconductor layer and an active layer interposed between the second conductivity-type semiconductor layer and the first conductivity-type semiconductor layer; a first contact layer comprising an outer contact portion disposed along a circumference of the mesa and contacting the first conductivity-type semiconductor layer near an edge of the gallium nitride substrate and a plurality of inner contact portions disposed in a region surrounded by the outer contact portion and contacting the first conductivity-type semiconductor layer; a second contact layer disposed on the mesa and contacting the second conductivity-type semiconductor layer; is an upper insulation layer having a first opening overlapping the first contact layer and a second opening overlapping the second contact layer; a first electrode pad electrically connected to the first contact layer through the first opening; and a second electrode pad electrically connected to the second contact layer through the second opening, wherein the light emitting diode is capable of operating at a current density of 150 A/cm2 or more and has a maximum junction temperature of 180°
C. or more. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A light emitting module, comprising:
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a printed circuit board; a submount mounted on the printed circuit board; and a light emitting diode comprising; a gallium nitride substrate; a first conductivity-type semiconductor layer disposed on the gallium nitride substrate; a mesa comprising a second conductivity-type semiconductor layer disposed on the first conductivity-type semiconductor layer and an active layer interposed between the second conductivity-type semiconductor layer and the first conductivity-type semiconductor layer; a first contact layer comprising an outer contact portion disposed along a circumference of the mesa and contacting the first conductivity-type semiconductor layer near an edge of the gallium nitride substrate and a plurality of inner contact portions disposed in a region surrounded by the outer contact portion and contacting the first conductivity-type semiconductor layer; a second contact layer disposed on the mesa and contacting the second conductivity-type semiconductor layer; an upper insulation layer having a first opening overlapping the first contact layer and a second opening overlapping the second contact layer; a first electrode pad electrically connected to the first contact layer through the first opening; and a second electrode pad electrically connected to the second contact layer through the second opening, wherein the light emitting diode is capable of operating at a current density of 150 A/cm2 or more and has a maximum junction temperature of 180°
C. or more, andwherein the light emitting diode is flip-bonded to the submount. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification