METALLIZATION OF CONDUCTIVE WIRES FOR SOLAR CELLS

• US 20180358481A1
• Filed: 08/21/2018
• Published: 12/13/2018
• Est. Priority Date: 09/30/2016
• Status: Active Grant

• Current Assignee: Maxeon Solar Pte Limited
• Original Assignee: Sunpower Corporation (Totalenergies Se), Total Marketing Services And Total Energies Nouvelles Activites USA
• Inventors: Sewell, Richard Hamilton, Barkhouse, David Aaron Randolph, Harder, Nils-Peter, Rose, Douglas
• Granted Patent: US 10,644,170 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 31/02008 for solar cells or solar cell modules
• CPC Class Codes: H01L 31/0504 specially adapted for series or parallel connection of solar cells in a module
• CPC Class Codes: H01L 31/0516 specially adapted for interconnection of back-contact solar cells
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H01L 31/188 Apparatus specially adapted for automatic interconnection of solar cells in a module
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.

Claims

1. A system for electrically coupling solar cells, the system comprising:

a wire guide to align conductive wires substantially parallel with at least one doped region of a semiconductor substrate; and

a bonding head of the wire guide to bond the conductive wires to the at least one doped region of the semiconductor substrate, wherein the wire guide inhibits lateral movement of the conductive wires in contact with the bonding head.

2. The system of claim 1, wherein the wire guide is aligned to the at least one doped region of a semiconductor substrate at an angle of at most 90 degrees.

3. The system of claim 1, wherein the wire guide comprises a plurality of grooves to align conductive wires substantially parallel with the at least one doped region of the semiconductor substrate.

4. The system of claim 3, further comprising a cover plate disposed over the wire guide, wherein the cover plate inhibits movement of the conductive wires in the plurality of grooves.

5. The system of claim 1, wherein the bonding head is configured to apply a mechanical force to bond the conductive wires to the at least one doped region of the semiconductor substrate.

6. The system of claim 1, further comprising another wire guide to align the conductive wires to the wire guide.

7. The system of claim 1, wherein the wire guide comprises a plurality of slots.

8. The system of claim 1, wherein the wire guide comprises stainless steel or graphite.

9. The system of claim 1, wherein the wire guide comprises a plurality of tubes.

10. The system of claim 9, wherein the plurality of tubes comprises a plurality of tubes having a half-tube extension.

11. A system for electrically coupling solar cells, the system comprising:

a wire guide to align conductive wires substantially parallel with a at least one doped region of a semiconductor substrate; and

a roller coupled to the bonding head of the wire guide, wherein the roller is configured to bond the conductive wires to the at least one doped region of the semiconductor substrate, and wherein the wire guide inhibits lateral movement of the conductive wires in contact with the roller coupled to the bonding head.

12. The system of claim 11, wherein the wire guide is aligned to the at least one doped region of a semiconductor substrate at an angle of at most 90 degrees.

13. The system of claim 11, wherein the wire guide comprises a plurality of grooves to align conductive wires substantially parallel with the at least one doped region of the semiconductor substrate.

14. The system of claim 13, further comprising a cover plate disposed over the wire guide, wherein the cover plate inhibits movement of the conductive wires in the plurality of grooves.

15. The system of claim 11, wherein the roller is a heated roller.

16. The system of claim 11, further comprising another wire guide to align the conductive wires to the wire guide.

17. The system of claim 11, wherein the wire guide comprises a plurality of slots.

18. The system of claim 11, wherein the wire guide comprises stainless steel or graphite.

19. The system of claim 11, wherein the wire guide comprises a plurality of tubes.

20. The system of claim 19, wherein the plurality of tubes comprises a plurality of tubes having a half-tube extension.