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INDUCTORS FOR CHIP TO CHIP NEAR FIELD COMMUNICATION

  • US 20180366535A1
  • Filed: 06/16/2017
  • Published: 12/20/2018
  • Est. Priority Date: 06/16/2017
  • Status: Active Grant
First Claim
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1. A device comprising:

  • at least one inductor positioned on a substrate, the substrate defining a plane, the at least one inductor having at least one turn in a plane that is perpendicular to the plane of the substrate, the at least one inductor being positioned for near field coupling with another inductorwherein the at least one inductor comprises segments of a first metal layer of the substrate and segments of a second metal layer, the segments being electrically coupled through at least one via to form at least one turn of the at least one inductor; and

    wherein the at least one turn of the at least one inductor has first and second ends and wherein the first end is laterally offset from the second end and the inductor is configured to generate additional turns in a multi-metal staircase pattern by connecting the first and second ends of the at least one turn.

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