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WAFER BONDING APPARATUS AND WAFER BONDING SYSTEM INCLUDING THE SAME

  • US 20180370210A1
  • Filed: 12/18/2017
  • Published: 12/27/2018
  • Est. Priority Date: 06/21/2017
  • Status: Active Grant
First Claim
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1. A wafer bonding apparatus comprising:

  • a first supporting plate comprising a first surface and at least one vacuum groove for vacuum-absorption of a first wafer on the first surface;

    a second supporting plate comprising a second surface facing the first surface, wherein a second wafer is on the second surface;

    a bonding initiator on the first supporting plate, wherein the bonding initiator is configured to initiate bonding between the first wafer to the second wafer; and

    an area sensor on the first supporting plate, wherein the area sensor is configured to detect a propagation state of bonding between the first wafer and the second wafer.

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