WAFER BONDING APPARATUS AND WAFER BONDING SYSTEM INCLUDING THE SAME
First Claim
1. A wafer bonding apparatus comprising:
- a first supporting plate comprising a first surface and at least one vacuum groove for vacuum-absorption of a first wafer on the first surface;
a second supporting plate comprising a second surface facing the first surface, wherein a second wafer is on the second surface;
a bonding initiator on the first supporting plate, wherein the bonding initiator is configured to initiate bonding between the first wafer to the second wafer; and
an area sensor on the first supporting plate, wherein the area sensor is configured to detect a propagation state of bonding between the first wafer and the second wafer.
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Accused Products
Abstract
Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.
13 Citations
20 Claims
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1. A wafer bonding apparatus comprising:
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a first supporting plate comprising a first surface and at least one vacuum groove for vacuum-absorption of a first wafer on the first surface; a second supporting plate comprising a second surface facing the first surface, wherein a second wafer is on the second surface; a bonding initiator on the first supporting plate, wherein the bonding initiator is configured to initiate bonding between the first wafer to the second wafer; and an area sensor on the first supporting plate, wherein the area sensor is configured to detect a propagation state of bonding between the first wafer and the second wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A wafer bonding apparatus comprising:
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a first supporting plate comprising a first surface and at least one vacuum groove for vacuum-absorption of a first wafer on the first surface; a second supporting plate comprising a second surface facing the first surface, wherein a second wafer is on the second surface; and a sensor on the first supporting plate that is configured to detect a state of bonding between the first wafer and the second wafer by two-dimensionally detecting whether the first wafer is separated from the first surface. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A wafer bonding system comprising:
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a chamber; a first supporting plate, in an upper portion of an interior of the chamber, the first supporting plate comprising a first surface and at least one vacuum groove configured to vacuum-absorb a first wafer located on the first surface; a second supporting plate in a lower portion of the interior of the chamber, the second supporting plate comprising a second surface facing the first surface, wherein a second wafer is on the second surface; a vertical moving apparatus configured to move the first supporting plate up or down; a bonding initiator on the first supporting plate that is configured to press the center portion of the first wafer toward the second wafer to initiate bonding between the first wafer and the second wafer; a vacuum pump configured to supply a vacuum to the at least one vacuum groove of the first supporting plate; a controller configured to control the vertical moving apparatus, the bonding initiator, and/or the vacuum pump; and an area sensor on the first supporting plate that is configured to detect a propagation state of the bonding between the first wafer and the second wafer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification